Rogers RO3035 Microwave PCB 2-Layer Rogers 3035 20mil 0.508mm Circuit Board Dk3.5 Df 0.0015 High Frequency PCB

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RO3035
• Model NO.: BIC-199-V1.54
• Material: PTFE
• Application: Antenna
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: RO3035
• Final Foil External: 1 Oz
• Surface Finish: Immersion Gold
• Minimum Trace and Space: 6 Mil/6 Mil
• Minimum / Maximum Holes: 0.4 mm / 5.0 mm
• Test: 100% Electrical Test Prior Shipment
• Contour/Cutting: Routing
• Via: Plated Through Hole(Pth), Minimum Size 0.4mm.
• Flamibility Rating: UL 94-V0 Approval Min.
• Transport Package: Vacuum
• Specification: 77 x 65mm=1PCS
• Trademark: Bicheng Technologies Limited
• Origin: China
• HS Code: 8534009000
• Production Capacity: 50000PCS/Month

Product Description

Rogers RO3035 Microwave PCB 2-Layer Rogers 3035 20mil 0.508mm Circuit Board DK3.5 DF 0.0015 High Frequency PCB
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Rogers RO3035 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. It was designed to offer exceptional electrical and mechanical stability at competitive prices.  The mechanical properties are consistent. This allows the designer to develop multi-layer board designs without encountering warpages or reliability problems. RO3035 materials exhibit a coefficient of thermal expansion(CTE) in the X and Y axis of 17 ppm/ºC. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability, with typical etch shrinkage, after etch and bake, of less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/ºC, which provides exceptional plated through-hole reliability, even in severe environments.

Typical applications:
1) Automotive radar
2) Cellular telecommunications systems
3) Datalink on cable systems
4) Direct broadcast satellites
5) Global positioning satellite antennas
6) Patch antenna for wireless communications
7) Power amplifiers and antennas
8) Power backplanes
9) Remote meter readers



PCB Specifications

Rogers RO3035 20mil 0.508mm High Frequency PCB DK3.5 RF PCB for Direct Broadcast Satellites
PCB SIZE	77 x 65mm=1PCS
BOARD TYPE	Double sided PCB
Number of Layers	2 layers
Surface Mount Components	NO
Through Hole Components	YES
LAYER STACKUP	copper ------- 18um(0.5 oz)+plate TOP layer
	RO3035 0.508mm
	copper ------- 18um(0.5 oz) + plate  BOT Layer
TECHNOLOGY
Minimum Trace and Space:	6 mil / 6 mil
Minimum / Maximum Holes:	0.4 mm / 5.0 mm
Number of Different Holes:	3
Number of Drill Holes:	57
Number of Milled Slots:	0
Number of Internal Cutouts:	1
Impedance Control:	no
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	RO3035 0.508mm
Final foil external:	1 oz
Final foil internal:	N/A
Final height of PCB:	0.6 mm ±0.1
PLATING AND COATING
Surface Finish	Immersion gold
Solder Mask Apply To:	N/A
Solder Mask Color:	N/A
Solder Mask Type:	N/A
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	N/A
Colour of Component Legend	N/A
Manufacturer Name or Logo:	N/A
VIA	Plated through hole(PTH), minimum size 0.4mm.
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Data Sheet of Rogers 3035 (RO3035)

RO3035 Typical Value
Property	RO3035	Direction	Units	Condition	Test Method
Electrical Properties
Dielectric Constant,εProcess	3.50±0.05	Z		10 GHz/23ºC	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign	3.6	Z		8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor,tanδ	0.0015	Z		10 GHz/23ºC	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	-45	Z	ppm/ºC	10 GHz -50ºCto 150ºC	IPC-TM-650 2.5.5.5
Volume Resistivity	10^7		MΩ.cm	COND A	IPC 2.5.17.1
Surface Resistivity	10^7		MΩ	COND A	IPC 2.5.17.1
Thermal Properties
Td	500		ºC TGA		ASTM D 3850
Coefficient of Thermal Expansion (-55 to 288ºC)	17 17 24	X Y Z	ppm/ºC	23ºC/50% RH	IPC-TM-650 2.4.4.1
Thermal Conductivity	0.5		W/M/K	50ºC	ASTM D 5470
Mechanical Properties
Copper Peel Stength	10.2		Ib/in.	1oz,EDC After Solder Float	IPC-TM 2.4.8
Young's Modulus	1025 1006		MPa	23ºC	ASTM D 638
Dimensional Stability (MD, CMD)	-0.11          0.11		mm/m	Condition A	IPC TM-650 2.2.4
Physical Properties
Flammability	V-0				UL 94
Moisture Absorption	0.04		%	D48/50	IPC-TM-650 2.6.2.1
Density	2.1		gm/cm^3	23ºC	ASTM D 792
Lead-free Process Compatible	Yes