Rogers RO4835 Circuit Board PCB Manufacturing of Shenzhen Electronics

• Customization: Available
• Structure: Multilayer Rigid PCB
• Dielectric: RO4835
• Model NO.: BIC-199-V2.1
• Material: Hydrocarbon Ceramic Laminates
• Application: Antennas
• Flame Retardant Properties: V0
• Processing Technology: Electrolytic Foil
• Production Process: Subtractive Process
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Brand: Rogers
• Surface Finish: Bare Copper, HASL, Enig, Immersion Silver, etc.
• Laminate Thickness: 10mil 20mil 30mil 10.7mil 20.7mil 30.7mil
• Layer Count: Single Sided PCB, Double Sided PCB, Multilayer PCB
• Solder Mask: Green, Black, Blue, Yellow, Red etc.
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

Rogers RO4835 High Frequency PCB 10mil 20mil 30mil ED Copper 10.7mil 20.7mil 30.7mil LoPro Copper
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

General Description
Rogers RO4835 PCBs, crafted as hydrocarbon ceramic laminates, stand out as antioxidative high-frequency materials engineered for peak stability in elevated-temperature environments. Unlike other hydrocarbon-based alternatives, RO4835 PCBs exhibit remarkable oxidation resistance, safeguarding performance over time. Tailored to blend superior high-frequency capabilities with cost-effective circuit fabrication, RO4835 laminates offer a winning combination for diverse applications. Their electrical and mechanical attributes closely mirror those of the trusted RO4350B substrates, ensuring a seamless transition for long-time users.

Crucially, oxidation poses a threat to all thermoset laminate materials, with prolonged exposure to heat causing gradual increases in a circuit substrate's dielectric constant and dissipation factor. RO4835 PCB 's enhanced resistance to oxidation makes it a prime choice for applications where maintaining consistent performance under challenging conditions is non-negotiable.

 

 
 

Features and Benefits
1. Significantly improved oxidation resistance compared to typical thermoset microwave materials, which are designed for performance sensitive, high volume applications.
2. Low loss exhibits excellent electrical performance allowing application with higher operating frequencies, especially ideal for automotive applications.
3. Tight dielectric constant tolerance results in controlled impedance transmission lines
4. Lead-free process compatible results in no blistering or delamination
5. Low Z-axis expansion results in reliable plated through holes
6. Low in-plane expansion coefficient remains stable over an entire range of circuit processing temperatures
7. CAF resistant
 

PCB Capability  (RO4835)

PCB Capability (RO4835)
PCB Material:	Hydrocarbon Ceramic Laminates
Designation:	RO4835
Dielectric constant:	3.48  (10 GHz)
Dissipation Factor	0.0037 (10 GHz)
Layer count:	Single Sided PCB, Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:	1oz (35µm), 2oz (70µm)
Dielectric thickness       (ED copper)	6.6mil (0.168mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm),  60mil (1.524mm)
Dielectric thickness (LoPro copper)	4mil (0.102mm), 7.3mil (0.186mm), 10.7mil (0.272mm), 20.7mil (0.526mm), 30.7mil (0.780mm), 60.7mil (1.542mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, Immersion gold, Immersion silver, Immersion tin, ENEPIG, OSP, Pure gold plated etc..

  
Typical Applications:
1. Automotive Radar and Sensors
2. Point-to point Microwave
3. Power Amplifiers
4. Phased - Array Radar
5. RF Components

Appendix: Typical Values of RO4835
 

Property	RO4835	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	3.48±0.05	Z	-	10 GHz/23ºC	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign	3.66	Z	-	8 to 40 GHz	Differential Phase Length Method
Dissipation Factortan,δ	0.0037	Z	-	10 GHz/23ºC	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	+50	Z	ppm/ºC	-100ºCto 150ºC	IPC-TM-650 2.5.5.5
Volume Resistivity	5 x 108		MΩ.cm	COND A	IPC-TM-650 2.5.17.1
Surface Resistivity	7 x108		MΩ	COND A	IPC-TM-650 2.5.17.1
Electrical Strength	30.2(755)	Z	Kv/mm(v/mil)		IPC-TM-650 2.5.6.2
Tensile Modulus	7780(1128)	Y	MPa(ksi)	RT	ASTM D 638
Tensile Strength	136(19.7)	Y	MPa(ksi)	RT	ASTM D 638
Flexural Strength	186 (27)		Mpa (kpsi)		IPC-TM-650 2.4.4
Dimensional Stability	<0.5	X,Y	mm/m (mils/inch)	after etch+E2/150ºC	IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion	10 12 31	X Y Z	ppm/ºC	-55ºCto288ºC	IPC-TM-650 2.4.41
Tg	>280		ºC TMA	A	IPC-TM-650 2.4.24.3
Td	390		ºC TGA		ASTM D 3850
Thermal Conductivity	0.66		W/m/oK	80ºC	ASTM C518
Moisture Absorption	0.05		%	48hrs immersion 0.060" sample Temperature 50ºC	ASTM D 570
Density	1.92		gm/cm3	23ºC	ASTM D 792
Copper Peel Stength	0.88 (5.0)		N/mm (pli)	after solder float 1 oz. EDC Foil	IPC-TM-650 2.4.8
Flammability	V-0				UL 94
Lead-free Process Compatible	Yes