Multilayer PCB Built on 1.6mm 4 Layer Fr-4 Copper Track

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: FR-4
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Basic Info.

Model NO.
BIC-879-V8.76
Material
Fiberglass Epoxy
Application
Communication
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Epoxy Resin
Board Thick
1.6mm
Surface Finish
Immersion Gold
out Layer Copper
35 Um (1 Oz)
Soldermask Color
Green
Silkscreen Color
White
Final Foil Internal
1 Oz
Minimum Trace and Space
7.8 Mil/ 5 Mil
Minimum / Maximum Holes
0.7 mm /5.0 mm
Via
Minimum Size 0.7mm
Test
100% Electrical Test
Transport Package
Vacuum
Specification
219mm x 272mm =8pcs
Trademark
Bicheng Enterprise Limited
Origin
China
HS Code
8534009000
Production Capacity
50000PCS/Month

Product Description

1.1 General description

This is a type of multilayer PCB built on FR-4 substrate with Tg 150°C for the application of
Heart monitors. It's 1.6 mm thick with white silkscreen(Taiyo) on green solder mask (Taiyo) and
immersion gold on pads. The base material is from ITEQ supplying 8 up PCBs per panel. They'
re fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 panels are packed for
shipment. 

1.2 Features and benifits    
    
a. Outstanding thermal resistance and suitable for lead-free process
b. Excellent surface planarity, helpful for PCBs with BGA packages to reduce failure rate during
    assembly and soldering.
c. Improved the speed of signal transmission
d. Reliability test, insulation resistance test and ionic contamination test
e. Delivery on time. Higher than 98% on-time-delivery rate.
f.  Small quantity order is accepted
g. Customer complaint rate: <1% 

1.3 Application

Preamplifier, Navigation System, GPS Tracking Devices, GPS Device, AC Drives, Biometric
Access Control, Mobile Broadband Router, Electronics Assembly, Memory Module, Weather
analysis     

1.4 Parameter and data sheet
PCB SIZE 219 x 272mm=8PCS
BOARD TYPE Multilayer PCB
Number of Layers 4 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 18um(0.5oz)+plate TOP layer
Prepreg 7628(41%) 0.185 mm
copper ------- 35um(1oz) MidLayer 1
FR-4 1.1 mm
copper ------- 35um(1oz) MidLayer 2
Prepreg 7628(41%) 0.185 mm
copper ------- 18um(0.5oz)+plate BOT layer
TECHNOLOGY  
Minimum Trace and Space: 7.8 mil/ 5 mil
Minimum / Maximum Holes: 0.7 mm /5.0 mm
Number of Different Holes: 4
Number of Drill Holes: 238
Number of Milled Slots: 0
Number of Internal Cutouts: 9
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy:  FR-4 Tg150ºC, er<5.4.IT-158,  ITEQ Supplied
Final foil external:  1 oz
Final foil internal:  1 oz
Final height of PCB:  1.6 mm ±0.16
PLATING AND COATING  
Surface Finish Immersion gold (19.61% ) 0.05 µm 
over 3 µm nickel
Solder Mask Apply To:  TOP and Bottom, 12micron Minimum
Solder Mask Color:  Green, PSR-2000GT600D, Taiyo Supplied.
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing, V-cut
MARKING  
Side of Component Legend TOP and Bottom.
Colour of Component Legend White, IJR-4000 MW300, Taiyo Supplied.
Manufacturer Name or Logo:  Marked on the board in a conductor and 
leged FREE AREA
VIA plated through hole(PTH), minimum size 0.7mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension:   0.0059"
Board plating: 0.0029"
Drill tolerance:  0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

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