4-Layer RO4003c/S1000-2m Hybrid PCB Board for RF Electronics

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Hydrocarbon Ceramic Woven Glass (Rogers)/Fr-4
• Model NO.: BIC-1095-V3.0
• Material: Fr-4 Epoxy Glass (Shengyi)
• Application: High-Frequency RF/Microwave Circuits
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Enig
• Base Material: Fr-4 Epoxy Glass (Shengyi)
• Insulation Materials: PTFE-Based (RO3010/RO3006) and Hydrocarbon
• Brand: Rogers/Shengyi
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Shipping Vacuum Packaging
• Specification: 76mm x 65mm (± 0.15mm tolerance)
• Trademark: bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
 

Overview of This Type of PCB

This 4-layer hybrid PCB combines Rogers RO4003C high-frequency material with S1000-2M FR-4 to deliver optimal RF performance and cost efficiency. Designed for demanding applications like cellular base stations and automotive radar, it features a 1.6mm thickness, ENIG surface finish, and controlled 50Ω impedance traces. The strategic material stackup provides excellent signal integrity while maintaining manufacturability through standard PCB processes.

 

 

PCB Construction Details (Summary Table)

Parameter	Specification
Base Material	RO4003C / S1000-2M
Layer Count	4 layers
Board Dimensions	76mm × 65mm (±0.15mm)
Min Trace/Space	4/7 mils
Min Hole Size	0.2mm
Via Type	Through-hole only (No Blind vias)
Finished Thickness	1.6mm
Copper Weight	1oz (35μm) per layer
Via Plating Thick	25μm
Surface Finish	ENIG (Immersion Gold)
Silkscreen	White (Both sides)
Solder Mask	Red (Both sides)
Impedance Control	50Ω differential (6/7 mil trace/gap)
Electrical Test	100% tested prior to shipment

 

Other Key Components & Features
Stackup:

• L1: Copper (35µm)

• Core: RO4003C (0.305mm)

• L2: Copper (35µm)

• Prepreg: 0.1mm

• Core: S1000-2M FR-4

• Prepreg: 0.1mm

• L3: Copper (35µm)

• Core: RO4003C (0.305mm)

• L4: Copper (35µm)

• 
  PCB Statistics:
  Components:        29
  Total Pads:         87
  Thru Hole Pads:     44
  Top SMT Pads:      32
   Bottom SMT Pads:    11
   Vias:              70
   Nets:              5
   

Material Advantages:
 

• RO4003C: 
      - Rogers RO4003C Hydrocarbon Ceramic woven glass 
      - Dielectric Constant of DK 3.38 at 10 GHz
      - Dissipation Factor of 0.0027 at 10GHz
      - Tg >280 °C, Td> 425°C 

• 
   

• S1000-2M:
      - Shengyi High Tg, Low CTE Epoxy Glass
      - Dielectric Constant of DK 4.6 at 1 GHz
      - Dissipation Factor of 0.0018 at 1 GHz
      - Tg >185 °C, Td> 180°C 
   

• 

•  

• Typical Applications:

• 5G base station antennas

• Automotive radar systems

• Satellite communication LNBs

• RFID tag readers

•  

Why Choose This PCB?

1.Optimized Cost-Performance: RO4003C for RF + FR-4 for structural layers

2.Reliable Construction: 25µm via plating and ENIG finish

3.Impedance Control: Precision 50Ω differential pairs

•  

Tags:Hybrid PCB, RF Circuit Board, 4-Layer Electronics, Telecom PCB

 

Order Now for Reliable PCB Manufacturing
This 4-layer hybrid Printed Circuit Board delivers the perfect balance of high-frequency performance and manufacturing practicality. Contact us for your custom PCB manufacturing needs!
 

Additional Notes:

Type of artwork supplied: Gerber RS-274-X
Quality standard: IPC-Class-2
Availability: Worldwide