Polyimide FPC Keypad Connector Flexible Printed Circuit

• Customization: Available
• Structure: Double-Sided FPC
• Material: Polyimide
• Model NO.: BIC-0409-V4.09
• Combination Mode: Adhesive Flexible Plate
• Application: Digital Products, Aviation and Aerospace
• Conductive Adhesive: Conductive Silver Paste
• Flame Retardant Properties: V0
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Final Height of PCB: 0.20mm
• Final Foil External: 35 Um
• Surface Finish: Immersion Gold
• Coverlay Colour: Yellow
• Color of Silkscreen: White
• RoHS Required: Yes
• Function: 100% Pass Electrical Test
• Transport Package: Transparent Bags
• Specification: 120.18 X 30.28mm
• Trademark: Bicheng Enterprise Limited
• Origin: China
• HS Code: 8534009000
• Production Capacity: 50000 Pieces Per Month

Product Description

1.1 General description

This is a type of flexible printed circuit for the application of keypad. It's a 2 layer FPC at 0.2mm
thick. The base laminate is from ITEQ, It's fabricated per IPC 6012 Class 2 using supplied Gerber
data. Polyimide stiffner is applied on the inserting part.

1.2 Features and benifits

A. Excellent flexibility
B. Reducing the volume
C. Weight reduction
D. Consistency of assembly
E. Increased reliability
F.  Controllability of electrical parameter design
G. The end can be whole soldered
H. Material optionality
I.  Low cost
J. Continuity of processing
K. Small quantity, prototypes and production.
L. DDU Door to door shipment with competitive shipping cost.

1.3 Application

Capacitive touch screen/panel, Industrial control interphone, Consumer electrostatic Bracelet
soft board

1.4 Parameter and data sheet

Size of Flexible PCB	120.18 X 30.28mm
Number of Layers	2
Board Type	Flexible PCB
Board Thickness	0.20mm
Board Material	Polyimide 25µm
Board Material Supplier	ITEQ
Tg Value of Board Material	60ºC
PTH Cu thickness	≥20 µm
Inner Iayer Cu thicknes	N/A
Surface Cu thickness	35 µm
Coverlay Colour	Yellow
Number of Coverlay	2
Thickness of Coverlay	25 µm
Stiffener Material	Polyimide
Stiffener Thickness	0.2mm
Type of Silkscreen Ink	IJR-4000 MW300
Supplier of Silkscreen	TAIYO
Color of Silkscreen	White
Number of Silkscreen	1
Peeling test of Coverlay	No peelable
Legend Adhesion	3M 90ºC No peeling after Min. 3 times test
Surface Finish	Immersion Gold
Thickness of Nickle/Gold	Au: 0.03µm(Min.); Ni 2-4µm
RoHS Required	Yes
Famability	94-V0
Thermal Shock Test	Pass, -25ºC±125ºC, 1000 cycles.
Thermal Stress	Pass, 300±5ºC,10 seconds, 3 cycles.  No delamination, no blistering.
Function	100% Pass electrical test
Workmanship	Compliance with IPC-A-600H & IPC-6013C Class 2

The Variety of flexible PCBs

Pattern developing