PCB Prototype Circuit Boards

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: FR-4
Shipping & Policy
Shipping Cost: Contact the supplier about freight and estimated delivery time.
Payment Methods:
visa mastercard discover JCB diners club american express T/T
PIX SPEI OXXO PSE OZOW
  Support payments in USD
Secure payments: Every payment you make on Made-in-China.com is protected by the platform.
Refund policy: Claim a refund if your order doesn't ship, is missing, or arrives with product issues.
Secured Trading Service
Gold Member Since 2017

Suppliers with verified business licenses

Audited Supplier Audited Supplier

Audited by an independent third-party inspection agency

to see all verified strength labels (14)
Find Similar Products

Basic Info.

Model NO.
BIC-450P. 1032-V2
Material
Fiberglass Epoxy
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Epoxy Resin
Model
PCB
Board Thick
1.6mm
Surface Finish
HASL Lead Free
Board Material
Fr-4
Number of Layer
2
Mininum Trace (Mil)
7.9 Mil
Minimum Gap(Mil)
6 Mil
Color of Silkscreen
White
Thickness of Solder Mask
14 Um
Transport Package
Vacuum
Specification
220 X 196mm
Trademark
bicheng enterprise limited
Origin
China
HS Code
8534009000
Production Capacity
50000 PCS/ Month

Product Description

PCB Circuit Board Dual Layers With HASL Lead Free



Commodity Introduction 
This is a type of 2 layer PCB circuit board at 1.6mm thick for the application of Electric Inverter. The base laminate is from IT158 FR-4, Green solder mask and White silkscreen on board. It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 panel boards are packed separately.


Parameters & Data Sheet 
Number of Layers 2
Board Type Double Sided PCB
Board Thickness 1.60 mm +/-0.16
Board Material FR-4 IT158
Board Material Supplier ITEQ
Tg Value of Board Material  135ºC
 
PTH Cu thickness ≥20 um (See hole wall details)
Inner Iayer Cu thicknes N/A
Surface Cu thickness 35 um (1oz)
 
Solder Mask Type and Model No. LPSM, PSR-2000GT600D
Solder Mask Supplier KUANG SHUN
Solder Mask Colour Green
Number of Solder Masks 2
Thickness of Solder Mask 14 um
 
Type of Silkscreen Ink IJR-4000 MW300
Supplier of Silkscreen TAIYO
Color of Silkscreen Whie
Number of Silkscreen 1
 
Mininum Trace (mil) 7.9 mil
Minimum Gap(mil) 6 mil
 
Surface Finish Lead Free HASL
RoHS Required Yes
Warpage  0.25%
 
Thermal Shock Test Pass, 288±5ºC,10 seconds, 3 cycles. No delamination, no blistering.
Solderablity Test Pass, 255±5ºC,5 seconds Wetting Area Least 95%
Function  100% Pass electrical test
Workmanship Compliance with IPC-A-600H & IPC-6012C Class 2


Microsection Hole Wall (um)
Hole Wall Cu Thickness ≥20 um  Hole Wall Cu Roughness ≤25.4 um
NO. A B C E AVE
1 25.998 24.798 24.858 26.498 25.778 25.408 25.557
2 24.871 23.671 23.731 25.371 24.610 24.281 24.429
3 24.773 23.573 23.633 25.273 24.553 24.183 24.332

Outline dimension  Unit: mm
NO. Required Dimension (toerance) Actual dimension
1 220.00 ±0.15 220.02 220.06 219.95 219.94
2 196.00 ±0.15 195.99 196.06 195.98 196.07

Hole Size and Slot Dimension (mm)
NO. Requerment Dimension (tolerance) PTH/NPT Actual dimension
1 0.925 ±0.076 Y 0.925 0.900 0.950 0.925
2 2.300 ±0.076 Y 2.300 2.275 2.325 2.300
3 3.200 ±0.05 N 3.200 3.175 3.225 3.200

How to specify a PCB?       
A PCB user generally needs to present all of the primary manufacturing data in a complete and unambiguous way that the PCB manufacturer can quote and produce the boards without error.  
   
A checklist is listed as follows. Some parameters not necessary for a particular job can be deleted so that the specification form only reflects the relevant data.
 (1) Company name
 (2) Part number
 (3) Lot size and annual requirements
 (4) Layer count
 (5) Board size
 (6) Board thickness
 (7) Board shape
 (8) Panelization
 (9) Board build-up
 (10) Boards with controlled impedance
 (11) Test coupon
 (12) Machining (Contouring)
 (13) Laminate type and UL flammability
 (14) Warp & Twist
 (15) Outer layers
 (16) Inner layers
 (17) Solderability preservation
 (18) Solder masks
 (19) Notation
 (20) Peelable solder mask
 (21) Carbon printing
 (22) Plated through holes (PTHs)
 (23) Non-PTHs
 (24) Milled Holes (Slots)
 (25) Blind via holes
 (26) Buried via holes
 (27) Board tooling holes
 (28) Panel tooling holes
 (29) Board mounting
 (30) Edge connectors
 (31) Soldering conditions
 (32) Markings
 (33) Electrical test
 (34) Automatic optical inspection
 (35) Minimum pattern conditions
 (36) Quality conditions





 

Send your message to this supplier

*From:
*To:
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now