| Customization: | Available |
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| Type: | Rigid Circuit Board |
| Dielectric: | PTFE-Based Woven Fiberglass and Ceramic-Filled COM |
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General Description
The Rogers AD250C Microwave and RF PCB is a high-performance circuit board designed for antenna applications. Built on Rogers AD250C laminates, this PCB features PTFE-based composites with woven fiberglass and micro-dispersed ceramic fillers, offering a controlled dielectric constant of 2.50 ± 0.04 and a low loss tangent of 0.0014 at 10 GHz. The use of low-profile reverse-treated ED copper foil reduces conductive losses and passive intermodulation (PIM), making it ideal for telecommunication infrastructure and antenna systems. Available in 20mil, 30mil, and 60mil thicknesses, this PCB is a cost-effective solution for high-frequency applications.
| Electrical Properties | AD250C | Units | Test Conditions | Test Method | |
| PIM (30mil/60mil) | -159/-163 | dBc | Reflected 43 dBm swept tones at 1900 MHz, S1/S1 | Rogers Internal 50 ohm | |
| Dielectric Constant (process) | 2.52 | - | 23°C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 (IPC TM-650 2.5.5.3) |
| Dielectric Constant (design) | 2.50 | - | C-24/23/50 | 10 GHz | Microstrip Differential Phase Length |
| Dissipation Factor (process) | 0.0013 | - | 23°C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 |
| Thermal Coefficient of Dielectric Constant | -117 | ppm/ºC | 0°C to 100°C | 10 GHz | IPC TM-650 2.5.5.5 |
| Volume Resistivity | 4.8 x 108 | Mohm-cm | C-96/35/90 | - | IPC TM-650 2.5.17.1 |
| Surface Resistivity | 4.1 x 107 | Mohm | C-96/35/90 | - | IPC TM-650 2.5.17.1 |
| Electrical Strength (dielectric strength) | 979 | V/mil | - | - | IPC TM-650 2.5.6.2 |
| Dielectric Breakdown | >40 | kV | D-48/50 | X/Y direction | IPC TM-650 2.5.6 |
| Thermal Properties | |||||
| Decomposition Temperature (Td) | >500 | ˚C | 2hrs @ 105˚C | 5% Weight Loss | IPC TM-650 2.3.40 |
| Coefficient of Thermal Expansion - x | 47 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
| Coefficient of Thermal Expansion - y | 29 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
| Coefficient of Thermal Expansion - z | 196 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
| Thermal Conductivity | 0.33 | W/mK | - | z direction | ASTM D5470 |
| Time to Delamination | >60 | minutes | as-received | 288˚C | IPC TM-650 2.4.24.1 |
| Mechanical Properties | |||||
| Copper Peel Strength after Thermal Stress | 2.6 (14.8) |
N/mm (lbs/in) | 10s @288˚C | 35 μm foil | IPC TM-650 2.4.8 |
| Flexural Strength (MD/CMD) | 8.8/6.4 (60.7/44.1) | MPa (ksi ) | 25°C ± 3°C | - | ASTM D790 |
| Tensile Strength (MD/CMD) | 6.0/5.6 (41.4/38.6) | MPa (ksi ) | 23°C/50% RH | - | ASTM D3039/D3039-14 |
| Flex Modulus (MD/CMD) | 885/778 (6,102/5,364) | MPa (ksi ) | 25°C ± 3°C | - | IPC-TM-650 Test Method 2.4.4 |
| Dimensional Stability (MD/CMD) | 0.02/0.06 | mils/inch | after etch + bake | - | IPC-TM-650 2.4.39a |
| Physical Properties | |||||
| Flammability | V-0 | - | - | - | UL-94 |
| Moisture Absorption | 0.04 | % | E1/105 +D48/50 | - | IPC TM-650 2.6.2.1 |
| Density | 2.28 | g/cm3 | C-24/23/50 | - | ASTM D792 |
| Specific Heat Capacity | 0.813 | J/g°K | 2 hours at 105°C | - | ASTM E2716 |
Typical Applications
1.Automotive Telematics Antenna Systems
2.Base Station Antenna Applications
3.Cellular Infrastructure Base Station Antennas
4.Commercial Satellite Radio Antennas
5.Digital Audio Broadcasting (DAB) Antennas
6.Radar Manifolds and Feed Networks
| PCB Capability (AD250C) | |
| PCB Material: | PTFE based Woven Fiberglass/Ceramic Filled Composites |
| Designation: | AD250C |
| Dielectric constant: | 2.50 (10 GHz) |
| Dissipation factor | 0.0013 (10 GHz) |
| Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Dielectric thickness | 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Immersion gold (ENIG), HASL, Immersion silver, Immersion tin, OSP, ENEPIG, Bare copper, Pure gold plated etc.. |
Our Advantages
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is a leading high-frequency PCB supplier and exporter based in Shenzhen, China. With over 19 years of experience, we specialize in serving industries such as cellular base station antennas, satellite systems, high-frequency passive components, microstrip and band line circuits, millimeter-wave equipment, radar systems, and digital radio frequency antennas. Our high-frequency PCBs are primarily built on materials from Rogers Corporation, Taconic, and Wangling, with dielectric constants ranging from 2.2 to 10.2.
We also offer a wide range of PCB solutions, including FR-4 circuit boards, flexible circuits, and metal core PCBs, catering to prototypes, small runs, and mass production. Our expertise extends to high-value-added projects such as HDI, quick-turn PCBs, impedance control, heavy copper boards, and backplane boards. This comprehensive product line allows us to meet diverse customer needs, from low-end to high-end applications.
Materials We Offer
Our materials include, but are not limited to:
Rogers: RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO4835, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210.
RT/Duroid: RT/Duroid 5880, RT/Duroid 5870, RT/Duroid 6002, RT/Duroid 6010, RT/Duroid 6035HTC, RT/Duroid 5880LZ.
Taconic: TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; TLF-35, RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8, TLX-9, TLY-3, TLY-5, TLY-5Z.
Wangling: F4B (DK2.2, DK2.65, DK2.85, DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2).
Other Materials: AD250C, AD255C, AD300D, AD350A, AD450, AD600, AD1000, TC350, TC600; DiClad 880, DiClad 870, DiClad 527, IsoClad 917; Nelco N4000, N9350, N9240.
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