14 microns Black Solder Mask Multilayer PCB board Tg170 FR4 with Immersion Gold No
Peeling off in Bluetooth Receiver
Commodity Introduction
This is a type of FR-4 PCB for the application of Bluetooth Receiver. It's a 6 Layer board at
1.6mm thick.The base laminate is from ITEQ, Solder mask and silkscreen from KUANG SHUN.
It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 10 boards or panels are
packed separately.
Parameters & Data Sheet
| Item |
Requirement |
Result |
| Laminate |
Type |
FR-4 |
FR-4 TG170 |
| Supplier |
ITEQ |
ITEQ |
| Board thickness |
1.6+/-10%mm |
1.58+/-1.64mm |
| Outer copper foil |
>=35 um |
42.37 um |
| Inner copper foil |
1/1 OZ |
1/1 OZ |
| Warp-twist |
<= 0.75% |
0.19% |
| Legend |
Type |
KUANG SHUN |
KUANG SHUN |
| Color |
White |
White |
| Location |
CS & SS |
CS & SS |
| Marking |
Co.logo |
As requirement |
OK |
| UL.logo |
94V0 |
94V0 |
| Date code |
WWYY |
WWYY |
| Marking form |
As requirement |
OK |
| Location |
CS |
|
| Min line width (mil) |
7 |
7.2 |
| Min line spacing (mil) |
5.5 |
5.3 |
| Min ring width (mil) |
NA |
NA |
| Solder Mask |
Type |
KSM-S6189BK31 |
KSM-S6189BK31 |
| Color |
Black |
Black |
| Thickness |
>=10 um |
13 um |
| Pencil Test |
6H OR ABOVE |
OK |
| SOLVENT TEST |
NO ATTACK |
OK |
| TAPE TEST |
NO PEEL OFF |
OK |
| Surface treament |
ENIG |
OK |
| Special Treament |
Silk screen |
/ |
/ |
| Location |
/ |
/ |
| Forming |
V-cut |
OK |
| Normal Testing |
Electrical test |
100% PCB passed |
OK |
| Visual inspection |
IPC-A-600H&IPC-6012C |
OK |
| Solderability Test |
245ºC 5S 1 Cycle |
OK |
Finished dimension (unit: mm): including v-cut
| NO |
Required Dimension (tolerance) |
Actual dimension |
| 1 |
93.82 |
93.75 |
93.88 |
93.86 |
93.88 |
| 2 |
190.50 |
190.54 |
190.47 |
190.47 |
190.53 |
Hole size and slot dimension(unit: mm, PTH tolerance +/-0.076, NPTH +/-0.05mm)
| NO |
Required |
PTH |
Actual dimension |
| 1 |
0.950 |
Y |
0.950 |
0.925 |
0.975 |
0.950 |
| 2 |
1.600 |
Y |
1.600 |
1.575 |
1.625 |
1.600 |
| 3 |
3.200 |
Y |
3.200 |
3.175 |
3.225 |
3.200 |
| 4 |
0.900 |
YY |
0.900 |
0.875 |
0.925 |
0.900 |
| 5 |
1.000 |
Y |
1.000 |
0.975 |
1.025 |
1.000 |
| 6 |
1.050 |
Y |
1.050 |
1.025 |
1.075 |
1.050 |
| 7 |
1.500 |
Y |
1.500 |
1.475 |
1.525 |
1.500 |
| 8 |
1.300 |
Y |
1.300 |
1.275 |
1.325 |
1.300 |
| 9 |
3.300 |
N |
3.300 |
3.275 |
3.325 |
3.300 |
| 10 |
2.000 |
N |
2.000 |
1.975 |
2.025 |
2.000 |
Learn PCB and Buy PCB
The Difficulty Factors for Multilayer boards
Multilayer PCB's represent one of the most complicates products in PCB industry. In order to
design producible multilayer PCB's, it is imperative that PCB designers understand the processes
and difficulty factors
*Build-up
The more layers in a multilayer PCB's, the greater risk of mis-registration during laminate process.
The difficulty factor, therefore, increase with an increasing layer counts.
*Core thickness of rigid inner laminates
Inner layers are normally based on thin rigid laminate cores with copper cladding. The thinner the
rigid laminates, the more difficult they are to handle, for example, in the etching process.
*Thickness tolerance (total thickness inclusive of copper foils)
The difficulty factor and the rejection rate depend very much upon the thickness tolerance required,
and indirectly upon the layer build-up. When thickness tolerance T=±10%, obviously rejection ratio
trends to zero.
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