Stabilizer PCB and Media Player Board Solutions with Professional PCBA Assembly

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: CEM-4
• Model NO.: BIC-050-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Aluminum
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers
• Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil
• Soldermask Color: Blcak, Blue, Yellow, Red, Green...
• Copper Weight: 0.5oz, 1oz, 2oz
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

Rogers RF PCBs Built on RO3210 50mil 1.27mm DK10.2 With Immersion Gold for Microstrip Patch Antennas
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Rogers RO3210 high frequency circuit materials are ceramic-filled laminates reinforced with woven fiberglass. These materials are engineered to offer exceptional electrical performance and mechanical stability. RO3210 laminates combine the surface smoothness of a non-woven PTFE laminate. Since these materials can be fabricated into PCB using standard PTFE circuit board processing techniques, it results in the mass production and get competitive price on the market. The dielectric constant of RO3210 substrate is 10.2 with a dissipation factor of 0.0027.



Typical applications:
1. Automotive collision avoidance systems
2. Automotive global positions satellite antennas
3. Base station infrastructure
4. Datalink on cable systems
5. Direct broadcast satellites
6. LMDS and wireless broadband
7. Microstrip patch antennas
8. Power backplanes
9. Remote meter readers
10. Wireless telecommunications systems


PCB Specifications

PCB SIZE	102 x 102mm=1PCS
BOARD TYPE	Double sided PCB
Number of Layers	2 layers
Surface Mount Components	YES
Through Hole Components	YES
LAYER STACKUP	copper ------- 18µm(0.5 oz)+plate TOP layer
	RO3210 1.270mm
	copper ------- 18µm(0.5 oz)+plate BOT layer
TECHNOLOGY
Minimum Trace and Space:	6 mil / 4 mil
Minimum / Maximum Holes:	0.4 mm / 2.5 mm
Number of Different Holes:	8
Number of Drill Holes:	32
Number of Milled Slots:	0
Number of Internal Cutouts:	NO
Impedance Control:	no
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	RO3210 1.270mm
Final foil external:	1 oz
Final foil internal:	1 oz
Final height of PCB:	1.3 mm ±10%
PLATING AND COATING
Surface Finish	Immersion gold
Solder Mask Apply To:	N/A
Solder Mask Color:	N/A
Solder Mask Type:	N/A
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	N/A
Colour of Component Legend	N/A
Manufacturer Name or Logo:	N/A
VIA	Plated through hole(PTH), minimum size 0.4mm.
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Data Sheet of Rogers 3210 (RO3210)

RO3210 Typical Value
Property	RO3210	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	10.2±0.5	Z		10 GHz 23ºC	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign	10.8	Z		8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor,tanδ	0.0027	Z		10 GHz 23ºC	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	-459	Z	ppm/ºC	10 GHz 0ºCto 100ºC	IPC-TM-650 2.5.5.5
Dimensional Stability	0.8	X, Y	mm/m	COND A	ASTM D257
Volume Resistivity	10^3		MΩ.cm	COND A	IPC 2.5.17.1
Surface Resistivity	10^3		MΩ	COND A	IPC 2.5.17.1
Tensile Modulus	579 517	MD CMD	kpsi	23ºC	ASTM D 638
Water Absorption	<0.1	-	%	D24/23	IPC-TM-650 2.6.2.1
Specific Heat	0.79		j/g/k		Calculated
Thermal Conductivity	0.81		W/M/K	80ºC	ASTM C518
Coefficient of Thermal Expansion (-55 to 288ºC)	13 34	X,Y Z	ppm/ºC	23ºC/50% RH	IPC-TM-650 2.4.4.1
Td	500		ºC	TGA	ASTM D3850
Density	3		gm/cm^3
Copper Peel Stength	11		pli	1oz,EDC After Solder Float	IPC-TM 2.4.8
Flammability	V-0				UL 94
Lead-free Process Compatible	Yes