Advanced 4-Layer Rigid-Flex PCB - 1.5mm/0.25mm Construction with Enig Finish

• Customization: Available
• Insulation Materials: Epoxy Resin
• Flame Retardant Properties: V0
• Model NO.: BIC-1004-V1.0
• Application: Communication
• Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil
• Soldermask Color: Blcak, Blue, Yellow, Red, Green...
• Copper Weight: 0.5oz, 1oz, 2oz
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

Advanced 4-Layer Rigid-Flex PCB - 1.5mm/0.25mm Construction with ENIG Finish
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

1. Premium Rigid-Flex PCB Overview
This sophisticated 4-layer rigid-flex PCB combines FR-4 and polyimide materials to deliver exceptional performance for complex electronic applications. Designed for high-density interconnects, aerospace systems, and advanced medical devices, this hybrid solution features 1.5mm rigid sections and ultra-thin 0.25mm flexible areas for optimal space utilization. With ENIG (Electroless Nickel Immersion Gold) surface finish and IPC-Class-2 certification, this board ensures reliability in demanding environments.

Key Technical Benefits:
Hybrid Construction: Seamless integration of rigid and flexible zones for three-dimensional packaging
High-Density Design: 7/8 mil trace/space capability supports complex circuitry
Enhanced Durability: Plated slot holes and resin-filled vias (IPC-4761 Type VII) improve mechanical strength
Signal Integrity: Controlled impedance with ±10% tolerance for critical applications
Visual Clarity: White silkscreen on matte black solder mask for excellent contrast

2. Comprehensive Specifications

Parameter	Specification
Base Materials	FR-4 Tg170 & Polyimide (Adhesiveless)
Layer Configuration	4-Layer Rigid-Flex
Panel Dimensions	121mm x 126mm (16-up panel)
Minimum Trace/Space	7/8 mils
Minimum Hole Size	0.2mm
Special Features	Plated slot holes, resin-filled vias
Section Thickness	1.5mm (Rigid) / 0.25mm (Flex)
Copper Weight	1 oz (35µm) all layers
Via Treatment	0.2mm resin-filled & capped
Surface Finish	ENIG
Solder Mask	Matte Black (Both Sides)
Silkscreen	White (Top & Bottom)
Quality Assurance	100% Electrical Tested

3. Advanced Engineering Features

Innovative Stackup Architecture
Conductive Layers: 35µm finished copper throughout
Dielectric System: FR-4 Tg170 with 2x1080 prepreg layers
Flex Core: Polyimide adhesiveless base for superior flexibility
Interlayer Bonding: Precision prepreg application for optimal lamination

Manufacturing Excellence
High Component Density: Supports 66 components with 152 total pads
Advanced Interconnects: 87 precision vias with resin filling
Assembly Support: Panelized solder paste stencil with 3 fiducial marks
File Compatibility: Gerber RS-274-X format for error-free fabrication

Material Advantages
Thermal Endurance: FR-4 Tg170 withstands high-temperature processes
Flex Reliability: Polyimide core ensures thousands of flex cycles
Environmental Resistance: Matte black solder mask provides UV protection

Target Applications
Aerospace Systems: Avionics and flight control electronics
Medical Equipment: Portable diagnostic devices and implants
Industrial Automation: Robotic control systems
Military Electronics: Ruggedized communication devices

Competitive Edge
1. Space Optimization: Combines rigid stability with flexible routing
2. High-Reliability Interconnects: Resin-filled vias prevent moisture ingress
3. Enhanced Solderability: ENIG finish ensures excellent component adhesion
4. Precision Manufacturing: 7/8 mil trace/space for complex designs

Request Your Custom Rigid-Flex Solution
Contact our engineering team for specialized configurations or volume production quotes. Ideal for applications requiring reliability in dynamic environments.

Thank you for your reading and you're welcome to contact us for your PCB enquiries.