RO4725jxr Antenna-Grade PCB: 30.7 Mil Thick with No Blind Vias, Enig Finish for 5g Base Stations

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RO4725jxr
• Model NO.: BIC-1229-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers/Taconic/Wangling
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

RO4725JXR Antenna-Grade PCB: 0.8mm Thick, 5/5 Mils Trace/Space, ENIG Finish for 5G Base Stations
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


1. Product Overview
This high-performance 2-layer antenna PCB utilizes Rogers RO4725JXR laminate, delivering PTFE-level performance at hydrocarbon laminate costs. Designed for 5G base station antennas and RF applications, this 0.8mm board features:

I. Ultra-Low PIM: -166dBc @1900MHz
II. Cost Efficiency: 30-40% savings vs traditional PTFE
III. 5G-Optimized: Dk=2.55±0.05 @10GHz
IV. Manufacturing Friendly: FR-4 compatible processing

Certified to IPC-Class 2 standards, it's ideal for mass production of antenna arrays.

2. Technical Specifications

Parameter	Specification
Material	RO4725JXR
Dimensions	42.13×112.96mm (±0.15mm)
Thickness	0.8mm (30.7mil core)
Copper	1oz LoPro® (35μm)
Trace/Space	5/5 mils
Holes	0.4mm (20μm plating)
Surface Finish	ENIG
Dk @10GHz	2.55±0.05
PIM Performance	<-160dBc

Stackup:
Layer 1: 35μm LoPro® Copper

Core: 0.78mm RO4725JXR

Layer 2: 35μm LoPro® Copper


3. Key Advantages & Applications
Material Superiority

Low-Profile Foil: Enables precise 5/5 mils antenna traces

Thermal Stability: CTE matched to copper (13.9/19/25.6 ppm/°C)

Lead-Free Compatible: Tg>280°C


Design Specifications

Components: 35 (57 SMT, 92 thru-hole)
Vias: 34 (antenna feed networks)
Nets: 3
Files Accepted: Gerber RS-274X


Target Applications

5G Massive MIMO: Base station antenna arrays

C-RAN Systems: Remote radio heads

Small Cells: Urban 5G deployments

IoT Gateways: High-efficiency antennas


Why RO4725JXR?
1. PIM-Optimized: <-160dBc for clean signal transmission
2. Cost-Effective: FR-4 processing with PTFE performance
3. 5G-Ready: Stable Dk across mmWave frequencies
4. Global Stock: Prototype to high-volume production


Key Differentiators:
LoPro® Copper: Reduces surface roughness for better RF performance

+34ppm/°C TCDk: More stable than standard hydrocarbon laminates

0.0026 Df @10GHz: Comparable to premium PTFE materials

No PTFE pre-treatment: Faster turnaround times

Tags:
RO4725JXR PCB, Antenna-Grade Board, 0.8mm RF PCB, 5/5 Mils Trace Space, ENIG Finish, 5G Antenna Array, Low-PIM PCB

Contact Our Antenna Specialists for design support or samples.


Thank you for your reading and you're welcome to contact us for your PCB enquiries.