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| Customization: | Available |
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| Type: | Rigid Circuit Board |
| Dielectric: | RO3003 |
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| Parameter | Details |
| Base material | RO3003 |
| Layer count | 3 Layers |
| Board dimensions | 115mm x 115mm=1PCS |
| Minimum Trace/Space | 5/7 mils |
| Minimum Hole Size | 0.35mm |
| Blind vias | No |
| Finished board thickness | 1.7mm |
| Finished Cu weight | 1 oz (1.4 mils) outer layers |
| Via plating thickness | 20 μm |
| Surface finish | Bare copper |
| Top/Bottom Silkscreen | No |
| Top/Bottom Solder Mask | No |
| Special requirements | 100% Electrical test prior to shipment |