Rogers RO4003c PCB 4-Layer 0.85mm Printed Circuit Board for RF Electronics

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Rogers RO4003c
• Model NO.: BIC-1292-V3.0
• Material: Rogers RO4003c Laminate
• Application: Automotive Radar & Sensors
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Immersion Silver
• Base Material: Rogers RO4003c Substrate
• Insulation Materials: Rogers RO4003c Substrate
• Brand: Rogers
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Shipping Vacuum Packaging
• Specification: 95.89mm × 55.87mm (± 0.15mm)
• Trademark: bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
 

Overview of This Type of PCB

The RO4003C 4-layer printed circuit board is a high-performance solution designed for demanding RF and wireless applications. Utilizing Rogers' proprietary RO4003C hydrocarbon/ceramic material with woven glass reinforcement, this multilayer PCB combines the electrical performance of PTFE with the manufacturability of epoxy/glass. With a stable dielectric constant of 3.38±0.05 and excellent thermal conductivity (0.71 W/m/K), this board is particularly suitable for cellular infrastructure, automotive radar, and other high-volume RF applications where performance and cost-efficiency are critical.

 

 

PCB Construction Details (Summary Table)

Specification	Value
Base Material	Rogers RO4003C
Layer Count	4-layer
Board Dimensions	95.89mm × 55.87mm (±0.15mm)
Finished Thickness	0.85mm
Copper Weight	1oz (35μm) all layers
Minimum Trace/Space	4/5 mils
Minimum Hole Size	0.3mm
Via Plating Thickness	20μm
Surface Finish	Immersion Silver
Solder Mask (Top/Bottom)	Green/No
Silkscreen (Top/Bottom)	White/No
Electrical Test	100% tested

 

Other Key Components & Features
Stackup:

• Copper_layer_1 - 35 μm
  Rogers 4003C Core - 0.203 mm (8mil)
  Copper_layer_2 - 35 μm
  RO4450F Bondply - 0.101 mm (4mil) *
  Copper_layer_1 - 35 μm
  Rogers 4003C Core - 0.406 mm (16mil)
  Copper_layer_2 - 35 μm

• 
  PCB Statistics:
  Components:       24
  Total Pads:         55
  Thru Hole Pads:     43
  Top SMT Pads:      12
  Bottom SMT Pads:    0
  Vias:              23
  Nets:              5
  
  Material Advantages:

• 1.Stable dielectric constant (3.38±0.05 @10GHz)

• 2.Low dissipation factor (0.0027 @10GHz)

• 3.Excellent thermal conductivity (0.71 W/m/K)

• 4.CTE matched to copper (X:11ppm, Y:14ppm)

• 5.Low moisture absorption (0.06%)

• 6.High Tg (>280°C)

• 7.FR-4 compatible processing

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• Typical Applications:

• Cellular base station antennas

• RF power amplifiers

• Automotive radar systems

• Satellite LNB components

• RFID systems

•  

Why Choose This PCB?

• 1.Cost-effective alternative to PTFE materials

• 2.Excellent multilayer performance

• 3.Simplified FR-4-like processing

• 4.Suitable for high-volume production

• 5.Stable thermal performance

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Tags:RF PCB, Multilayer Circuit Board, Wireless Electronics, RO4003C PCB

Ordering Benefits:

• Reliable performance in RF systems

• Cost-effective volume production

• Proven solution for telecom infrastructure

• Compatible with standard PCB processes

 

Type of artwork supplied: Gerber RS-274-X
Quality standard: IPC-Class-2
Availability: Worldwide

This advanced multilayer PCB combines RO4003C's superior material properties with 0.85mm construction, delivering exceptional RF performance at a competitive price point. Its balanced electrical and thermal characteristics make it particularly suitable for high-volume wireless applications where both performance and manufacturing efficiency are essential.