Customization: | Available |
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Type: | Rigid Circuit Board |
Dielectric: | RO3006 |
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Parameter | Specification |
Material | RO3006 |
Dimensions | 63.44×48.5mm (2-up) |
Thickness | 0.3mm |
Copper | 1oz (35μm) |
Trace/Space | 4/4 mils |
Holes | 0.3mm (20μm plating) |
Surface Finish | ENIG |
Dk @10GHz | 6.15±0.15 |
Thermal Conductivity | 0.79 W/mK |