RO4350b Ultra-Thin 4mil PCB: High-Frequency Board with Enepig 1oz Cu Weight for 5g & RF Applications

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: RO4350b
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  • RO4350b Ultra-Thin 4mil PCB: High-Frequency Board with Enepig 1oz Cu Weight for 5g & RF Applications
  • RO4350b Ultra-Thin 4mil PCB: High-Frequency Board with Enepig 1oz Cu Weight for 5g & RF Applications
  • RO4350b Ultra-Thin 4mil PCB: High-Frequency Board with Enepig 1oz Cu Weight for 5g & RF Applications
  • RO4350b Ultra-Thin 4mil PCB: High-Frequency Board with Enepig 1oz Cu Weight for 5g & RF Applications
  • RO4350b Ultra-Thin 4mil PCB: High-Frequency Board with Enepig 1oz Cu Weight for 5g & RF Applications
  • RO4350b Ultra-Thin 4mil PCB: High-Frequency Board with Enepig 1oz Cu Weight for 5g & RF Applications
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Basic Info.

Model NO.
BIC-1228-V1.0
Material
Fiberglass Epoxy
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Hydrocarbon Resin
Model
PCB
Brand
Rogers/Taconic/Wangling
Board Types
Rigid PCB
Test
100% Electrical Test Prior Shipment
Type of Artwork to Be Supplied
Email File, Gerber RS-274-X, PCB.Doc etc
Service Area
Worldwide, Globally
Transport Package
Packing
Specification
≤ 400mm X 500mm
Trademark
Bicheng
Origin
China
HS Code
8534009000
Production Capacity
10000PCS/Year

Product Description

RO4350B Ultra-Thin 0.2mm PCB: High-Frequency Board with 4/5 Mils Trace/Space for 5G & RF Applications
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)



1. Product Overview
This ultra-thin 2-layer PCB features Rogers RO4350B laminate, delivering PTFE-level RF performance with FR-4 processability. Designed for 5G infrastructure, automotive radar, and satellite communications, this 0.2mm board offers:

I. Cost-Effective RF Solution: 40% lower cost than PTFE laminates
II. High-Frequency Precision: Dk=3.48±0.05 @10GHz
III. Thermal Stability: CTE matched to copper (10/12/32 ppm/°C)
IV. Manufacturing Simplicity: No special via treatments required

Certified to IPC-Class 2 and UL 94 V-0 standards.

RO4350b Ultra-Thin 4mil PCB: High-Frequency Board with Enepig 1oz Cu Weight for 5g & RF Applications
2. Technical Specifications
Parameter Specification
Material RO4350B
Dimensions 43.98×33.22mm (±0.15mm)
Thickness 0.2mm (4mil core)
Copper 1oz (35μm)
Trace/Space 4/5 mils
Holes 0.3mm (20μm plating)
Surface Finish ENEPIG
Dk @10GHz 3.48±0.05
Thermal Conductivity 0.69 W/mK


Stackup:
Layer 1: 35μm Cu + ENEPIG

Core: 0.102mm RO4350B

Layer 2: 35μm Cu + ENEPIG


3. Key Advantages & Applications
Material Benefits


FR-4 Compatibility: Standard drilling/plating processes

High Tg: >280°C for lead-free assembly

Moisture Resistant: 0.06% absorption


Design Specifications
Components: 9 (11 SMT, 21 thru-hole)
Vias: 22 (high-density interconnect)
Nets: 2
Files Accepted: Gerber RS-274X


Target Applications
5G mmWave: Small cell antennas

Automotive Radar: 77-79GHz ADAS systems

Satellite Comms: LNB modules

RFID Systems: High-frequency tags


Why RO4350B?
1. 4/5 Mils Precision: Supports dense RF layouts
2. ENEPIG Finish: Optimal for wire bonding
3. AEC-Q200 Ready: Automotive qualified
4. Global Availability: Prototype to volume

RO4350b Ultra-Thin 4mil PCB: High-Frequency Board with Enepig 1oz Cu Weight for 5g & RF Applications
Thank you for your reading and you're welcome to contact us for your PCB enquiries.

 

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