20.7mil RO4003C LoPro Reverse Treated Foil with Gold for Low Noise Block
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
RO4003C LoPro laminates make use of a unique Rogers' technology. With this technology, the reverse - treated foil can be bonded to the standard RO4003C dielectric. This leads to a laminate that has low conductor loss, improving insertion loss and signal integrity. Additionally, it maintains all the other beneficial attributes of the standard RO4003C laminate system.
Features and Benefits:
RO4003C materials are reinforced hydrocarbon/ceramic laminates with very low profile reverse treated foil.
1. Lower insertion loss
2. Low PIM
3. Increased signal integrity
4. High circuit density
Low Z-axis coefficient of thermal expansion
1. Multi-layer board capability
2. Design flexibility
Lead-free process compatible
1. High temperature processing
2. Meets environmental concerns
CAF resistant
Our PCB Capability (RO4003C LoPro)
| Our PCB Capability (RO4003C LoPro) |
| PCB Material: |
Hydrocarbon Ceramic Laminates |
| Designation: |
RO4003C LoPro |
| Dielectric constant: |
3.38±0.05 |
| Layer count: |
Double Layer, Multilayer, Hybrid PCB |
| Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: |
12.7mil (0.323mm), 16.7mil (0.424mm), 20.7mil(0.526mm), 32.7mil (0.831mm), 60.7mil(1.542mm) |
| PCB size: |
≤400mm X 500mm |
| Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
| Surface finish: |
Bare copper, HASL, ENIG, OSP, Immersion tin etc.. |
Some Typical Applications:
- Digital applications such as servers, routers, and high speed back planes
- Cellular base station antennas and power amplifiers
- LNB's for direct broadcast satellites
- RF Identification Tags
Typical Properties of RO4003C LoPro
| RO4003C LoPro |
| Property |
Typical Value |
Direction |
Units |
Condition |
Test Method |
| Dielectric Constant, Process |
3.38 ± 0.05 |
z |
-- |
10 GHz/23°C |
IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant, Design |
3.5 |
z |
-- |
8 to 40 GHz |
Differential Phase Length Method |
| Dissipation Factor tan, |
0.0027 0.0021 |
z |
-- |
10 GHz/23°C 2.5 GHz/23°C |
IPC-TM-650 2.5.5.5 |
| Thermal Coeffifi cient of r |
40 |
z |
ppm/°C |
-50°C to 150°C |
IPC-TM-650 2.5.5.5 |
| Volume Resistivity |
1.7 X 1010 |
|
MΩ•cm |
COND A |
IPC-TM-650 2.5.17.1 |
| Surface Resistivity |
4.2 X 109 |
|
MΩ |
COND A |
IPC-TM-650 2.5.17.1 |
| Electrical Strength |
31.2(780) |
z |
KV/mm(V/mil) |
0.51mm(0.020") |
IPC-TM-650 2.5.6.2 |
| Tensile Modulus |
26889(3900) |
Y |
MPa(kpsi) |
RT |
ASTM D638 |
| Tensile Strength |
141(20.4) |
Y |
MPa(kpsi) |
RT |
ASTM D638 |
| Flexural Strength |
276(40) |
|
MPa(kpsi) |
|
IPC-TM-650 2.4.4 |
| Dimensional Stability |
<0.3 |
X,Y |
mm/m(mils/inch) |
after etch +E2/150°C |
IPC-TM-650 2.4.39A |
| Coeffifi cient of Thermal Expansion |
11 |
x |
ppm/°C |
-55 to 288°C |
IPC-TM-650 2.1.41 |
| 14 |
y |
| 46 |
z |
| Tg |
>280 |
|
°C TMA |
A |
IPC-TM-650 2.4.24.3 |
| Td |
425 |
|
°C TGA |
|
ASTM D3850 |
| Thermal Conductivity |
0.64 |
|
W/m/°K |
80°C |
ASTM C518 |
| Moisture Absorption |
0.06 |
|
% |
48 hrs immersion 0.060" sample Temperature 50°C |
ASTM D570 |
| Density |
1.79 |
|
gm/cm3 |
23°C |
ASTM D792 |
| Copper Peel Strength |
1.05(6.0) |
|
N/mm(pli) |
after solder float 1 oz. TC Foil |
IPC-TM-650 2.4.8 |
| Flammability |
N/A |
|
|
|
UL 94 |
| Lead-Free Process Compatible |
Yes |
|
|
|
|
Audited Supplier 
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