Rogers Rt/Duroid 5870 PCB Double Sided Black Soldermask Coating Immersion Gold

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: CEM-3
• Model NO.: BIC-016-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Aluminum
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Panasonic
• Tihickness: 8mil, 10mil,12mil, 20mil, 32mil and 60mil
• Soldermask Color: Blcak, Blue, Yellow, Red, Green...
• Copper Weight: 0.5oz, 1oz, 2oz
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

Rogers RT/duroid 5870 High Frequency Printed Circuit Board RT5870 PCB Board 10mil, 20mil, 31mil and 62mil Coating with Immersion Gold
(PCB's are custom-made products, the picture and parameters shown are just for reference)

Hello Everyone,
Today, we introduce high frequency PCB built on RT/duroid 5870 laminates.

RT/duroid 5870 is glass microfiber reinforced PTFE composite of Rogers Corporation, which is designed for exacting stripline and microstrip circuit applications.

Let's see the reasons for using RT/duroid 5870 material.
1) The randomly oriented microfibers result in exceptional dielectric constant uniformity.
2) The dielectric constant of RT/duroid 5870 laminates is uniform from panel to panel and is constant over a wide frequency range.
3) Its low dissipation factor extends the usefulness of RT/duroid 5870 laminates to Ku-band and above.
4) Designed for microstrip and stripline application

Our PCB Capability (RT/duroid 5870)

PCB Material:	Glass microfiber reinforced PTFE composites
Designator:	RT/duroid 5870
Dielectric constant:	2.33  ±0.02 (process)
	2.33 (design)
Layer count:	1 Layer, 2 Layer, Multilayer, Hybrid type (Mixed)
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:	10mil (0.254mm), 20mil (0.508mm)
	31mil (0.787mm), 62mil (1.575mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion tin, OSP.

RT/duroid 5870 is often used in double sided PCB, multilayer PCB and hybrid PCB.It's available in a variety of thicknesses for double sided PCB, such as 10mil, 20mil, 31mil and 62mil. Surface finishes are bare copper, HASL, ENIG, Immersion tine and OSP for option.


The typical applications are microstrip and stripline circuits, commercial airline broadband antenna,radar systems, millimeter wave applications, point to point digital radio antenna etc.


The basic colour of RT/duroid 5870 PCB is black.


We specialize in providing you with prototype, small batches and mass production service.
If you have any questions, please feel free to contact us.
Thank you for your reading.

Appendix: Properties of RT/duroid 5870

RT/duroid 5870 Typical Value
Property	RT/duroid 5870		Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	2.33 2.33±0.02 spec.		Z	N/A	C24/23/50 C24/23/50	1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5
Dielectric Constant,εDesign	2.33		Z	N/A	8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor,tanδ	0.0005 0.0012		Z	N/A	C24/23/50 C24/23/50	1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5
Thermal Coefficient of ε	-115		Z	ppm/ºC	-50ºCto 150ºC	IPC-TM-650 2.5.5.5
Volume Resistivity	2 x 10^7		Z	Mohm cm	C/96/35/90	ASTM D 257
Surface Resistivity	3 x 10^7		Z	Mohm	C/96/35/90	ASTM D 257
Specific Heat	0.96(0.23)		N/A	j/g/k (cal/g/c)	N/A	Calculated
Tensile Modulus	Test at 23ºC	Test at 100ºC	N/A	MPa(kpsi)	A	ASTM D 638
	1300(189)	490(71)	X
	1280(185)	430(63)	Y
Ultimate Stress	50(7.3)	34(4.8)	X
	42(6.1)	34(4.8)	Y
Ultimate Strain	9.8	8.7	X	%
	9.8	8.6	Y
Compressive Modulus	1210(176)	680(99)	X	MPa(kpsi)	A	ASTM D 695
	1360(198)	860(125)	Y
	803(120)	520(76)	Z
Ultimate Stress	30(4.4)	23(3.4)	X
	37(5.3)	25(3.7)	Y
	54(7.8)	37(5.3)	Z
Ultimate Strain	4	4.3	X	%
	3.3	3.3	Y
	8.7	8.5	Z
Moisture Absorption	0.02		N/A	%	0.62"(1.6mm) D48/50	ASTM D 570
Thermal Conductivity	0.22		Z	W/m/k	80ºC	ASTM C 518
Coefficient of Thermal Expansion	22 28 173		X Y Z	ppm/ºC	0-100ºC	IPC-TM-650 2.4.41
Td	500		N/A	ºC TGA	N/A	ASTM D 3850
Density	2.2		N/A	gm/cm^3	N/A	ASTM D 792
Copper Peel	27.2(4.8)		N/A	Pli(N/mm)	1oz(35mm)EDC foil after solder float	IPC-TM-650 2.4.8
Flammability	V-0		N/A	N/A	N/A	UL 94
Lead-free Process Compatible	Yes		N/A	N/A	N/A	N/A