RO4535 Circuit Board PCB Manufacturing of Shenzhen Electronics

• Customization: Available
• Structure: Double-Sided Rigid PCB
• Dielectric: RO4535
• Model NO.: BIC-190-V2.1
• Material: Ceramic-Filled, Glass-Reinforced Hydrocarbon
• Application: Antenna
• Flame Retardant Properties: V0
• Processing Technology: Electrolytic Foil
• Production Process: Subtractive Process
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Brand: Rogers
• Surface Finish: Immersion Gold
• Laminate Thickness: 30mil
• Layer Count: Double Sided PCB
• Dielectric Constant: 3.44
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

Rogers RO4535 High Frequency Printed Circuit Board RO4535 60mil 30mil 20mil Antenna PCB with Immersion Gold, Silver and Tin
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

General Description
This antenna PCB is fabricated using Rogers RO4535 material with a 30 - mil substrate. It initiates with a 0.5 - ounce copper layer, which is then processed to a final thickness of 1 ounce. The top side features a green solder mask, while the entire bottom layer undergoes immersion gold plating.
Designed as a double - layer board,  Rogers RO4535 PCB adheres to the IPC class 2 standard, ensuring consistent quality and performance. Prior to shipment, every single board undergoes a comprehensive 100% electrical test, either via a flying probe or a dedicated test fixture, guaranteeing its reliability and functionality upon arrival.

 

 
PCB Specification

PCB SIZE	75 x 170mm=1up
BOARD TYPE	Double sided PCB
Number of Layers	2 layers
Surface Mount Components	YES
Through Hole Components	NO
LAYER STACKUP	copper ------- 17um(0.5 oz)+plate TOP layer
	Rogers RO4535 0.762mm
	copper ------- 17um(0.5 oz) + plate  BOT Layer
TECHNOLOGY
Minimum Trace and Space:	4 mil / 4 mil
Minimum / Maximum Holes:	0.3 mm / 3.0 mm
Number of Different Holes:	8
Number of Drill Holes:	358
Number of Milled Slots:	0
Number of Internal Cutouts:	0
Impedance Control:	no
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	Rogers RO4535 0.762mm
Final foil external:	1.0 oz
Final foil internal:	N/A
Final height of PCB:	0.8 mm ±0.1
PLATING AND COATING
Surface Finish	Immersion Gold, 37.8%
Solder Mask Apply To:	Top side
Solder Mask Color:	Green
Solder Mask Type:	LPI
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	Component Side
Colour of Component Legend	White
Manufacturer Name or Logo:	N/A
VIA	Plated through hole(PTH), minimum size 0.3mm.
FLAMIBILITY RATING	94V-0
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

 

Our Advantages

1. Powerful PCB capabilities support your research and development, sales and marketing;
2. PCB Products and Manufacturing are certified by authorized organizations;
3. 16000 workshop with 30000 output capability and 8000 types of PCB's per month;
4. Quick CADCAM checking and free PCB quotation;
5. No minimum order quantity. 1 piece is available;
6. A Team with passion, discipline, responsibility and honesty;
7. More than 19+ years of high frequency PCB experience;
8. Prototype PCB capability to Volume Production capability;
9. Delivery on time: >98%, Customer complaint rate: <1%
10. IPC Class 2 / IPC Class 3;

Our PCB Capabilities(2022)

Parameter	Value
Layer Counts	1-32
Substrate Material	RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc.
Maximum Size	Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm
Board Outline Tolerance	±0.0059" (0.15mm)
PCB Thickness	0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm)	±8%
Thickness Tolerance(t<0.8mm)	±10%
Insulation Layer Thickness	0.00295" - 0.1969" (0.075mm--5.00mm)
Minimum Track	0.003" (0.075mm)
Minimum Space	0.003" (0.075mm)
Outer Copper Thickness	35µm--420µm (1oz-12oz)
Inner Copper Thickness	17µm--350µm (0.5oz - 10oz)
Drill Hole(Mechanical)	0.0059" - 0.25" (0.15mm--6.35mm)
Finished Hole(Mechanical)	0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical)	0.00295" (0.075mm)
Registration (Mechanical)	0.00197" (0.05mm)
Aspect Ratio	12:1
Solder Mask Type	LPI
Min Soldermask Bridge	0.00315" (0.08mm)
Min Soldermask Clearance	0.00197" (0.05mm)
Plug via Diameter	0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance	±10%
Surface Finish	HASL,HASL LF,ENIG,Immersion Tin,Immersion Silver, OSP, Gold Finger, Pure gold plated etc.

 

RO4535 Typical Values

Property	RO4535	Direction	Units	Condition	Test Method
Dielectric Constant, er Process	3.44 ± 0.08	Z	-	10 GHz/23ºC 2.5 GHz	IPC-TM-650,2.5.5.5
Dissipation Factor	0.0032	Z	-	2.5 GHz/23ºC	IPC-TM-650, 2.5.5.5
	0.0037			10 GHz/23ºC
PIM (Typical)	-157	-	dBc	Reflected 43 dBm swept tones	Summitek 1900b PIM Analyzer
Dielectric Strength	>500	Z	V/mil	0.51 mm	IPC-TM-650, 2.5.6.2
Dimensional Stability	<0.5	X,Y	mm/m (mils/inch)	after etch	IPC-TM-650, 2.4.39A
Coefficient of Thermal Expansion	16	X	ppm/ºC	-55 to 288ºC	IPC-TM-650, 2.4.41
	17	Y
	50	Z
Thermal Conductivity	0.6	-	W/(m.K)	80ºC	ASTM C518
Moisture Absorption	0.09	-	%	D48/50	IPC-TM-650, 2.6.2.1 ASTM D570
Tg	>280	-	ºC TMA	A	IPC-TM-650, 2.4.24.3
Density	1.9	-	gm/cm3	-	ASTM D792
Copper Peel Strength	5.1  (0.9)	-	lbs/in (N/mm)	1 oz. EDC post solder float	IPC-TM-650, 2.4.8
Flammability	V-0	-	-	-	UL 94
Lead-Free Process Compatible	Yes	-	-	-	-