SMT Stencil for PCB Assembly Solder Paste Laser Profile

Product Details
Customization: Available
Mode of Production: Laser Cut
Layers: Double-Layer
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Basic Info.

Model NO.
BIC-427-V4.27
Base Material
Stainless Steel Shim
Certification
RoHS, ISO
Customized
Customized
Structure
Stencil Foils with Aluminum Frame
Foil Thickness
0.1mm
Aperture
Laser Cut
Appearance
Engraving and Electro Polishing
Advantages1
a) High Precision Dimension;
Advantages2
B) Good Shape on The Window;
Advantages3
C) Hole Wall Is Smoother.
Fiducial Mark
Through Hole
Application
Csp, BGA, 0.5mm Qfp etc Package
Transport Package
Kk Carton (Hard Card)
Specification
420 mm x 520 mm x 20mm=1pcs
Trademark
Bicheng Enterprise Limited
Origin
China
HS Code
7314200000
Production Capacity
50000PCS/Month

Product Description

Product profile

1.1 General description

This is a type of solder paste SMT stencil (100% laser cut) built on 0.1mm stainless
steel foil with aluminum frame 420 mm x 520 mm x 20mm dimension. It's fabricated
per IPC 7525A using supplied Gerber data, squeegee area locating in the center.
Fiducal marks are through holes to suit for the SMT machine. It's packed with KK
carton (hard card) and usually 2 stencils are packed for shipment.

1.2 Features and benifits    

A. The data file is used directly to produce and reduce the error rate;
B. The opening position accuracy of SMT template is very high: the whole process error
     is ≤ ±4 μ m;
C. The opening of SMT template has geometric figure, which is advantageous to the
     printing and forming of tin paste;
D. Engineering design prevents problems from occurring in pre production;
E. Money-saving, Worry-saving and Labor-saving;
F.  Door to door shipment service;
G. More than 9000 types per month;
H. No minimum order quantity. 1 piece is available;

1.3 Application

SMD package such as PLCC,QFP,0402,0201,BGA,Flip Chip

1.4 Parameter and data sheet
Dimension: 370mm x 470mm, 420mm x 520mm, 550mm x 650mm
Structure Stencil foils with aluminum frame
Base material Stainless steel shim
Foil Thickness 0.05mm, 0.06mm, 0.08mm, 0.1mm, 0.12mm, 
0.15mm, 0.18mm, 0.2mm
Aperture configured Laser cut
Appearance Engraving and electro polishing
Fiducial mark Through hole
Service area: Worldwide
Quantity of open pads: 1533
Advantages: a) High precision dimension; b) Good shape on the window; 
c) Hole wall is smoother.
Application: CSP, BGA, 0.5mm QFP etc. package

1.5 Opening Hole Design for Stencil
Component 
Type
Pitch Soldering Width Soldering 
Length
Opening Width Opening 
Length
Shim Thickness
PLCC 1.27mm 0.65mm 2.00mm 0.60mm 1.95mm 0.15-0.25mm
QFP 0.635mm 0.35mm 1.50mm 0.32mm 1.45mm 0.15-0.18mm
QFP 0.50mm 0.254-0.33mm 1.25mm 0.22-0.25mm 1.20mm 0.12-0.15mm
QFP 0.40mm 0.25mm 1.25mm 0.20mm 1.20mm 0.10-0.12mm
QFP 0.30mm 0.20mm 1.00mm 0.15mm 0.95mm 0.07-0.12mm
0402   0.50mm 0.65mm 0.45mm 0.60mm 0.12-0.15mm
0201   0.25mm 0.40mm 0.23mm 0.35mm 0.07-0.12mm
BGA 1.27mm 0.80mm   0.75mm 0.75mm 0.15-0.20mm
BGA 1.00mm 0.38mm   0.35mm 0.35mm 0.10-0.12mm
BGA 0.50mm 0.30mm   0.28mm 0.28mm 0.07-0.12mm
Flip Chip 0.25mm 0.12mm 0.12mm 0.12mm 0.12mm 0.08-0.10mm
Flip Chip 0.20mm 0.10mm 0.10mm 0.10mm 0.10mm 0.05-0.10mm




 

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