M6 R5775g Multilayer PCB of Shenzhen Bicheng Electronic PCB Design

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: M6 R-5775g
• Model NO.: BIC-174-V2.1
• Material: Low Dk Glass Cloth
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Model: PCB
• Brand: Panasonic
• Solder Mask: Black
• Layer Count: 4-Layer
• Application: Antenna
• Surface Finish: Immersion Gold
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

M6 High Speed PCB Panasonic R-5775 Low Loss Multilayer Circuit Board
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

Brief Introduction
This four - layer circuit board is constructed using Panasonic Megtron6 (M6) R - 5775G, a high - speed, low - loss material. The outer layers feature a 1 - ounce copper thickness, and black solder mask is applied to both the top and bottom surfaces. The pads are treated with an electroless nickel and immersion gold (ENIG) plating process. For shipping purposes, each batch of 50 boards is vacuum - packed.

PCB Specifications

PCB SIZE	95 x 96mm=1up
BOARD TYPE	Multilayer PCB
Number of Layers	4 layers
Surface Mount Components	YES
Through Hole Components	YES
LAYER STACKUP	copper ------- 17um(0.5 oz)+plate TOP layer
	Prepreg
	copper ------- 18um(0.5 oz)
	R-5775G 0.25mm
	copper ------- 18um(0.5 oz)
	Prepreg
	copper ------- 17um(0.5 oz)+plate BOT layer
TECHNOLOGY
Minimum Trace and Space:	4 mil / 4 mil
Minimum / Maximum Holes:	0.3 mm / 6.0 mm
Number of Different Holes:	2
Number of Drill Holes:	6
Number of Milled Slots:	1
Number of Internal Cutouts:	no
Impedance Control:	no
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	R-5775G
Final foil external:	1.0 oz
Final foil internal:	0.5 oz
Final height of PCB:	0.8 mm ±0.1
PLATING AND COATING
Surface Finish	Immersion gold, 22%
Solder Mask Apply To:	Top Layer and Bottom layer
Solder Mask Color:	Black
Solder Mask Type:	Kuangshun
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	Top Layer
Colour of Component Legend	White
Manufacturer Name or Logo:	N/A
VIA	Plated through hole(PTH), minimum size 0.3mm.
FLAMIBILITY RATING	94V-0
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

 Manufacturing Process of Multi-layer PTH PCB (via filled)
(1). Material Shearing     
(2). Inner Layer Dry Film          
(3). Inner Layer Etching          
(4). AOI 1            
(5). Black Oxidation           
(6). Milling Outline Frame          
(7). Inner Layer Drilling      
(8). PTH 1
(9). Inner Layer Dry Film
(10). Pattern Plating 1
(11). Via filled
(12). Outer Layer Drilling
(13). PTH 2
(14). Pattern Plating 2
(15). Outer Layer Dry Film
(16). Copper-tin Electro-Plating
(17). Peeling and Etching
(18). AOI 2
(19). Solder Mask
(20). Silkscreen Printing
(21). Surface Finishing
(22). Electrical Testing
(23). Prolie Contouring
(24). FQC
(25). Packaging
(26). Delivery

Main Applications:
Antenna (Automotive millimeter wave radar, Base station)
ICT infrastructure equipment
Measuring instrument
Super computer
 

CAPABILITY
2500-3000 types each month.

SERVICE AREA
North America, Oceania, Southeast Asia, Eastern Europe, Africa, Latin America, Western & Southern Europe, Northern Europe, Central & South Asian, Middle East.