Rogers Ad255c High Frequency PCB Circuit Wholesale Electronics Board

• Customization: Available
• Structure: Multilayer Rigid PCB
• Dielectric: Ad255c
• Model NO.: BIC-197-V2.1
• Material: Glass-Reinforced, PTFE Based Composites
• Application: Antennas
• Flame Retardant Properties: V0
• Processing Technology: Electrolytic Foil
• Production Process: Subtractive Process
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Brand: Rogers
• Surface Finish: Immersion Silver, Immersion Gold, etc.
• Laminate Thickness: 20mil 30mil 40mil 60mil
• Layer Count: Double Sided PCB, Multilayer PCB, Hybrid PCB
• Solder Mask: Green, Black, Blue, Yellow, Red etc.
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

TC600 High Frequency PCB 50mil 1.27mm Double Sided Microwave Circuit Board With Immersion Silver
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

General Description
Rogers AD255C PCBs are high-performance, glass-reinforced PTFE composites meticulously designed to meet the rigorous demands of modern wireless antenna systems. AD255C PCB materials offer a tightly controlled dielectric constant of 2.55, ultra-low loss performance (dissipation factor of 0.0013 at 10 GHz with ED or reverse-treated copper), and exceptional passive intermodulation (PIM) stability, ensuring minimal signal distortion in high-power applications. Available in thicknesses ranging from 20 to 125 mils, AD255C substrates empower antenna designers to optimize impedance matching, reduce insertion loss, and enhance overall system efficiency across 5G, IoT, and aerospace applications.
 

 
PCB Capability (AD255C)
 

PCB Capability (AD255C)
PCB Material:	Glass-reinforced, PTFE based Composites
Designation:	AD255C
Dielectric constant:	2.55  (10 GHz)
Dissipation Factor	0.0013 (10 GHz)
Layer count:	Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:	1oz (35µm), 2oz (70µm)
Dielectric thickness:	20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm), 125mil (3.175mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Immersion gold, HASL, Immersion silver, Immersion tin, OSP, ENEPIG, Bare copper, Pure gold etc..

 

Typical Applications
Automotive telematics antenna systems
Cellular infrastructure base station antenna
Commercial satellite radio antenna

 

About Us
We are an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipment, radar systems, digital radio frequency antenna and other fields worldwide for 19 years. Our high frequency PCBs are mainly built on 3 high frequency material brands: Rogers Corporation, Taconic and Wangling. Dielectric constant ranges from 2.2 to 10.2 etc.

Our advantages

1. Powerful PCB capabilities support your research and development, sales and marketing;
2. PCB Products and Manufacturing are certified by authorized organizations;
3. 16000 workshop with 30000 output capability and 8000 types of PCB's per month;
4. Quick CADCAM checking and free PCB quotation;
5. No minimum order quantity. 1 piece is available;
6. A Team with passion, discipline, responsibility and honesty;
7. More than 19+ years of high frequency PCB experience;
8. Prototype PCB capability to Volume Production capability;
9. Delivery on time: >98%, Customer complaint rate: <1%
10. IPC Class 2 / IPC Class 3;

Appendix: Typical Value of AD255C

Electrical Properties	AD255C	Units	Test Conditions		Test Method
PIM (30mil/60mil)	-159/-163	dBc	Reflected 43 dBm swept tones at 1900 MHz, S1/S1		Rogers Internal 50 ohm
Dielectric Constant (process)	2.55	-	23°C @ 50% RH	10 GHz	IPC TM-650 2.5.5.5 (IPC TM-650 2.5.5.3)
Dielectric Constant (design)	2.60	-	C-24/23/50	10 GHz	Microstrip Differential Phase Length
Dissipation Factor (process)	0.0013	-	23°C @ 50% RH	10 GHz	IPC TM-650 2.5.5.5
Thermal Coefficient of Dielectric Constant	-110	ppm/ºC	0°C to 100°C	10 GHz	IPC TM-650 2.5.5.5
Volume Resistivity	7.4 x 108	Mohm-cm	C-96/35/90	-	IPC TM-650 2.5.17.1
Surface Resistivity	3.6 x 107	Mohm	C-96/35/90	-	IPC TM-650 2.5.17.1
Electrical Strength (dielectric strength)	911	V/mil	-	-	IPC TM-650 2.5.6.2
Dielectric Breakdown	>40	kV	D-48/50	X/Y direction	IPC TM-650 2.5.6
Thermal Properties
Decomposition Temperature (Td)	>500	˚C	2hrs @ 105˚C	5% Weight Loss	IPC TM-650 2.3.40
Coefficient of Thermal Expansion - x	34	ppm/˚C	-	-55˚C to 288˚C	IPC TM-650 2.4.41
Coefficient of Thermal Expansion - y	26	ppm/˚C	-	-55˚C to 288˚C	IPC TM-650 2.4.41
Coefficient of Thermal Expansion - z	196	ppm/˚C	-	-55˚C to 288˚C	IPC TM-650 2.4.41
Thermal Conductivity	0.35	W/mK	-	z direction	ASTM D5470
Time to Delamination	>60	minutes	as-received	288˚C	IPC TM-650 2.4.24.1
Mechanical Properties
Copper Peel Strength after Thermal Stress	2.4 (13.6)	N/mm (lbs/in)	10s @288˚C	35 μm foil	IPC TM-650 2.4.8
Flexural Strength (MD/CMD)	8.8/6.4 (60.7/44.1)	MPa (ksi )	25°C ± 3°C	-	ASTM D790
Tensile Strength (MD/CMD)	8.1/6.6 (55.8/45.5)	MPa (ksi )	23°C/50% RH	-	ASTM D3039/D3039-14
Flex Modulus (MD/CMD)	930/818 (6,412/5,640)	MPa (ksi )	25°C ± 3°C	-	IPC-TM-650 Test Method 2.4.4
Dimensional Stability (MD/CMD)	0.03/0.07	mils/inch	after etch + bake	-	IPC-TM-650 2.4.39a
Physical Properties
Flammability	V-0	-	-	-	UL-94
Moisture Absorption	0.03	%	E1/105 +D48/50	-	IPC TM-650 2.6.2.1
Density	2.28	g/cm3	C-24/23/50	-	ASTM D792
Specific Heat Capacity	0.813	J/g°K	2 hours at 105°C	-	ASTM E2716