Ad255c High Frequency PCB Board at Low Electronic Components Price

• Customization: Available
• Structure: Double-Sided Rigid PCB
• Dielectric: Ad255c
• Model NO.: BIC-198-V2.1
• Material: Glass-Reinforced, PTFE Based Composites
• Application: Antennas
• Flame Retardant Properties: V0
• Processing Technology: Electrolytic Foil
• Production Process: Subtractive Process
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Brand: Rogers
• Surface Finish: Immersion Gold
• Laminate Thickness: 60mil
• Layer Count: Double Sided PCB
• Final Foil External: 1.0 Oz
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: 98 x 100mm=1up
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

AD255C High Frequency PCB 60mil 1.524mm Antenna Circuit Board Double Layer with Immersion Gold
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

General Description
This specialized antenna PCB, constructed on Rogers AD255C high-performance PCBs, features a double-layer design with top-layer antenna pads and a bottom-layer shielding copper plane. Fabricated on a 60mil substrate with 1oz electrodeposited copper on both sides, the entire board is immersion gold-plated (no solder mask or silkscreen) to ensure optimal conductivity and corrosion resistance. Manufactured to IPC Class II standards and rigorously 100% electrically tested prior to shipment, Rogers AD255C PCB delivers reliable performance for critical wireless applications, including 5G, IoT, and aerospace systems.
 

 
PCB Specifications

BOARD TYPE	Double sided PCB
Number of Layers	2 layers
Surface Mount Components	YES
Through Hole Components	NO
LAYER STACKUP	copper ------- 17um(0.5 oz)+plate TOP layer
	AD255C 1.524mm
	copper ------- 17um(0.5 oz) + plate  BOT Layer
TECHNOLOGY
Minimum Trace and Space:	118 mil / 118 mil
Minimum / Maximum Holes:	1.5 mm / 1.5 mm
Number of Different Holes:	1
Number of Drill Holes:	1
Number of Milled Slots:	0
Number of Internal Cutouts:	0
Impedance Control:	no
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	AD255C 1.524mm
Final foil external:	1.0 oz
Final foil internal:	N/A
Final height of PCB:	1.6 mm ±0.1
PLATING AND COATING
Surface Finish	Immersion Gold, 90.8%
Solder Mask Apply To:	N/A
Solder Mask Color:	N/A
Solder Mask Type:	N/A
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	N/A
Colour of Component Legend	N/A
Manufacturer Name or Logo:	N/A
VIA	Plated through hole(PTH), minimum size 1.5mm.
FLAMIBILITY RATING	94V-0
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Our Advantages

1. More than 19+ years of high frequency PCB experience;
2. Eligible products rate of first production: >99%  
3. ISO9001, ISO14001, ISO13485, UL certified manufacturing factory;
4. 16000 workshop; 30000 output capability per month;
5. Experienced sales persons provide skilled customer services;
6. No minimum order quantity and low cost sample;
7. Prototype PCB capability and Volume Production capability;
8. Customer complaint rate: <1%
9. IPC Class 2 / IPC Class 3;
10. Based in China serving the whole world.

 

Our PCB Capability (2022)

Parameter	Value
Layer Counts	1-32
Substrate Material	RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO4835, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; RT/duroid 5880LZ; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5, TLY-5Z; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD250C, AD255C, AD300D, AD350A, AD450, AD600, AD1000, TC350; TC600; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc.
Maximum Size	Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm
Board Outline Tolerance	±0.0059" (0.15mm)
PCB Thickness	0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm)	±8%
Thickness Tolerance(t<0.8mm)	±10%
Insulation Layer Thickness	0.00295" - 0.1969" (0.075mm--5.00mm)
Minimum Track	0.003" (0.075mm)
Minimum Space	0.003" (0.075mm)
Outer Copper Thickness	35µm--350µm (1oz-10oz)
Inner Copper Thickness	17µm--350µm (0.5oz - 10oz)
Drill Hole(Mechanical)	0.0079" - 0.25" (0.2mm--6.35mm)
Finished Hole(Mechanical)	0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical)	0.00295" (0.075mm)
Registration (Mechanical)	0.00197" (0.05mm)
Aspect Ratio	12:1
Solder Mask Type	LPI
Min Soldermask Bridge	0.00315" (0.08mm)
Min Soldermask Clearance	0.00197" (0.05mm)
Plug via Diameter	0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance	±10%
Surface Finish	HASL,HASL LF,ENIG,Immersion Tin,Immersion Silver, OSP, Gold Finger, Pure gold plated etc.