F4btme300 PCB Digital Radio Receiver and Remote Control Motherboard PCB Manufacturer

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: F4btme300
• Model NO.: BIC-099-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Aluminum
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Wangling
• Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil
• Soldermask Color: Blcak, Blue, Yellow, Red, Green...
• Copper Weight: 0.5oz, 1oz, 2oz
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

F4BTME300 High Frequency PCB PTFE RF PCB Built on 3.0mm thick with Immersion Silver
(PCB's are custom-made products, the picture and parameters shown are just for reference)

Hello everybody,
Today we talk about a type of F4BTME high frequency circuit board - F4BTME300 PCB.

This PCB features a size of 170 mm x 95 mm and is designed as a double-sided board with two layers. It supports surface mount components, while through-hole components are not included in this design. The layer stackup consists of a top layer with 35 µm (1 oz) copper starting with 0.5oz  plating, paired with a core material of F4BTME300 that is 3.0 mm thick. The bottom layer also comprises 35 µm (1 oz) copper with plating. This PCB uses immersion silver, providing excellent solderability and protection. Notably, there is no solder mask applied to this board, allowing for direct access to the copper layers.

PCB Specifications

PCB SIZE	170 x 95mm=1PCS
BOARD TYPE	Double sided PCB
Number of Layers	2 layers
Surface Mount Components	YES
Through Hole Components	NO
LAYER STACKUP	copper ------- 35um(0.5 oz+plate )TOP layer
	F4BTME300 -3.0mm
	copper ------- 35um(0.5 oz + plate)  BOT Layer
TECHNOLOGY
Minimum Trace and Space:	7 mil / 7 mil
Minimum / Maximum Holes:	0.5 mm / 0.6 mm
Number of Different Holes:	5
Number of Drill Holes:	16
Number of Milled Slots:	0
Number of Internal Cutouts:	2
Impedance Control:	no
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	F4BTME300 DK 3.0
Final foil external:	1oz
Final foil internal:	N/A
Final height of PCB:	3.1 mm ±10%
PLATING AND COATING
Surface Finish	Immersion silver
Solder Mask Apply To:	no
Solder Mask Color:	no
Solder Mask Type:	no
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	NO
Colour of Component Legend	NO
Manufacturer Name or Logo:	Marked on the board in a conductor and leged FREE AREA
VIA	Non-Plated through hole(PTH), minimum size 0.5mm.
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

The basic color of F4BTME300 PCB is brown.

F4BTME High Frequency Laminates
The F4BTME series laminates are manufactured through a meticulous process that involves the scientific formulation of glass fiber cloth, nano-ceramic fillers, and polytetrafluoroethylene (PTFE) resin.

These substrates are built upon the F4BM dielectric layer and incorporate high dielectric constant and low loss nano-ceramics. This integration results in enhanced dielectric constant, superior heat resistance, reduced thermal expansion coefficient, increased insulation resistance, and improved thermal conductivity, all while maintaining low loss characteristics.

Furthermore, F4BTME laminates are specifically paired with reverse-treated RTF copper foil, providing exceptional performance in terms of PIM, precise line control, and minimized conductor loss.

The dielectric constant ranges from 2.98 to 3.5 and ED Copper foil available with 0.5oz, 1oz, 1.5oz and 2oz, RTF copper available with 0.5oz and 1oz; thickness available of from 0.254mm to 12.0mm.


Data Sheet (F4BTME300)

Product Technical Parameters				Product Models & Data Sheet
Product Features		Test Conditions	Unit	F4BTME298	F4BTME300	F4BTME320	F4BTME350
Dielectric Constant (Typical)		10GHz	/	2.98	3.0	3.2	3.5
Dielectric Constant Tolerance		/	/	±0.06	±0.06	±0.06	±0.07
Loss Tangent (Typical)		10GHz	/	0.0018	0.0018	0.0020	0.0025
		20GHz	/	0.0023	0.0023	0.0026	0.0035
Dielectric Constant Temperature Coefficient		-55 º~150ºC	PPM/ºC	-78	-75	-75	-60
Peel Strength		1 OZ F4BTM	N/mm	>1.6	>1.6	>1.6	>1.6
		1 OZ F4BTME	N/mm	>1.4	>1.4	>1.4	>1.4
Volume Resistivity		Standard Condition	MΩ.cm	≥1×10^7	≥1×10^7	≥1×10^7	≥1×10^7
Surface Resistivity		Standard Condition	MΩ	≥1×10^6	≥1×10^6	≥1×10^6	≥1×10^6
Electrical Strength (Z direction)		5KW,500V/s	KV/mm	>26	>30	>32	>32
Breakdown Voltage (XY direction)		5KW,500V/s	KV	>34	>35	>40	>40
Coefficientof Thermal Expansion	XY direction	-55 º~288ºC	ppm/ºC	15,16	15,16	13,15	10,12
	Z direction	-55 º~288ºC	ppm/ºC	78	72	58	51
Thermal Stress		260ºC, 10s,3 times		No delamination	No delamination	No delamination	No delamination
Water Absorption		20±2ºC, 24 hours	%	≤0.05	≤0.05	≤0.05	≤0.05
Density		Room Temperature	g/cm3	2.25	2.25	2.20	2.20
Long-Term Operating Temperature		High-Low Temperature Chamber	ºC	-55~+260	-55~+260	-55~+260	-55~+260
Thermal Conductivity		Z direction	W/(M.K)	0.42	0.42	0.50	0.54
PIM		Only applicable to F4BTME	dBc	≤-160	≤-160	≤-160	≤-160
Flammability		/	UL-94	V-0	V-0	V-0	V-0
Material Composition		/	/	PTFE, Fiberglass Cloth, nano-ceramics F4BTM paired with ED copper foil, F4BTME paired with reverse-treated (RTF) copper foil.

Thank you for your reading and you're welcome to contact us for your PCB enquiries.