F4bm265 Control Panel Motherboard PCB Dk 2.65 PTFE RF Circuit Board with 3oz Copper Coating Immersion Gold

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: F4bm265
• Model NO.: BIC-098-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Aluminum
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Wangling
• Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil
• Soldermask Color: Blcak, Blue, Yellow, Red, Green...
• Copper Weight: 0.5oz, 1oz, 2oz
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

F4BM265 High Frequency PCB DK 2.65 PTFE RF Circuit Board with 3oz Copper Coating Immersion Gold
(PCB's are custom-made products, the picture and parameters shown are just for reference)

Hello everybody,
Today we talk about a type of F4BM high frequency circuit board.

F4BM series laminates are made by scientifically formulating and strictly pressing a combination of fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film. Its electrical performance is improved compared to F4B, mainly due to a wider range of dielectric constants, lower dielectric loss, increased insulation resistance, and improved stability. It can replace similar foreign products.

PCB Specifications

Layer count:	Double sided
Designator	F4BM265 (DK 2.65)
Dimension:	210 x 115mm/1up
Finished thickness	1.6mm ±10%
Finished Copper weight:	3oz
SMOBC:	No
Surface finish:	Immersion gold

The main specifications of this board is double sided board, substrate is F4BM265 with DK value at 2.65, 210mm long by 115mm wide, 1.6mm finished thick, finished copper 3oz, no solder mask no silkscreen, and surface finish is immersion gold.

Let's see the stack up.

Top layer and bottom layer are 3oz copper finished. F4BM265 dielectric material is in the middle of 2 layers copper, showing dielectric constant at 2.65



From the photo of this board, the track is thicker than normal boards; surface finish is immersion gold and no solder mask and silkscreen.

Our PCB Capability (F4BM)

PCB Material:	PTFE glass fiber cloth copper clad laminates
Designation                        (F4BM )	F4BM	DK (10GHz)	DF (10 GHz)
	F4BM217	2.17±0.04	0.0010
	F4BM220	2.20±0.04	0.0010
	F4BM233	2.33±0.04	0.0011
	F4BM245	2.45±0.05	0.0012
	F4BM255	2.55±0.05	0.0013
	F4BM265	2.65±0.05	0.0013
	F4BM275	2.75±0.05	0.0015
	F4BM294	2.94±0.06	0.0016
	F4BM300	3.00±0.06	0.0017
Layer count:	Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness               (or overall thickness)	0.127mm (dielectric), 0.2mm, 0.25mm, 0.5mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.5mm, 1.524mm, 1.575mm, 2.0mm, 2.5mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..

The dielectric constant of F4BM material is wide, ranging 2.17 to 3.0. Board thickness ranges 0.13mm to 12.0mm. We can provide you with prototype service, small batches and mass production service.

Should you have any questions, please feel free to contact us.
Thank you for your reading.

Appendix: Data Sheet (F4BM)

Product Technical Parameters

Product Model & Data Sheet

Product Features

Test Conditions

Unit

F4BM217

F4BM220

F4BM233

F4BM245

F4BM255

F4BM265

F4BM275

F4BM294

F4BM300

Dielectric Constant (Typical)

10GHz

/

2.17

2.2

2.33

2.45

2.55

2.65

2.75

2.94

3.0

Dielectric Constant Tolerance

/

/

±0.04

±0.04

±0.04

±0.05

±0.05

±0.05

±0.05

±0.06

±0.06

Loss Tangent (Typical)

10GHz

/

0.001

0.001

0.0011

0.0012

0.0013

0.0013

0.0015

0.0016

0.0017

20GHz

/

0.0014

0.0014

0.0015

0.0017

0.0018

0.0019

0.0021

0.0023

0.0025

Dielectric Constant Temperature Coefficient

-55ºC~150ºC

PPM/ºC

-150

-142

-130

-120

-110

-100

-92

-85

-80

Peel Strength

1 OZ F4BM

N/mm

>1.8

>1.8

>1.8

>1.8

>1.8

>1.8

>1.8

>1.8

>1.8

1 OZ F4BME

N/mm

>1.6

>1.6

>1.6

>1.6

>1.6

>1.6

>1.6

>1.6

>1.6

Volume Resistivity

Standard Condition

MΩ.cm

≥6×10^6

≥6×10^6

≥6×10^6

≥6×10^6

≥6×10^6

≥6×10^6

≥6×10^6

≥6×10^6

≥6×10^6

Surface Resistivity

Standard Condition

MΩ

≥1×10^6

≥1×10^6

≥1×10^6

≥1×10^6

≥1×10^6

≥1×10^6

≥1×10^6

≥1×10^6

≥1×10^6

Electrical Strength (Z direction)

5KW,500V/s

KV/mm

>23

>23

>23

>25

>25

>25

>28

>30

>30

Breakdown Voltage (XY direction)

5KW,500V/s

KV

>30

>30

>32

>32

>34

>34

>35

>36

>36

Coefficientof Thermal Expansion

XY direction

-55 º~288ºC

ppm/ºC

25, 34

25, 34

22, 30

20, 25

16, 21

14, 17

14, 16

12, 15

12, 15

Z direction

-55 º~288ºC

ppm/ºC

240

240

205

187

173

142

112

98

95

Thermal Stress

260ºC, 10s,3 times

No delamination

No delamination

No delamination

No delamination

No delamination

No delamination

No delamination

No delamination

No delamination

Water Absorption

20±2ºC, 24 hours

%

≤0.08

≤0.08

≤0.08

≤0.08

≤0.08

≤0.08

≤0.08

≤0.08

≤0.08

Density

Room Temperature

g/cm3

2.17

2.18

2.20

2.22

2.25

2.25

2.28

2.29

2.29

Long-Term Operating Temperature

High-Low Temperature Chamber

ºC

-55~+260

-55~+260

-55~+260

-55~+260

-55~+260

-55~+260

-55~+260

-55~+260

-55~+260

Thermal Conductivity

Z direction

W/(M.K)

0.24

0.24

0.28

0.30

0.33

0.36

0.38

0.41

0.42

PIM

Only applicable to F4BME

dBc

≤-159

≤-159

≤-159

≤-159

≤-159

≤-159

≤-159

≤-159

≤-159

Flammability

/

UL-94

V-0

V-0

V-0

V-0

V-0

V-0

V-0

V-0

V-0

Material Composition

/

/

PTFE, Fiberglass Cloth F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil.

Thank you for your reading and you're welcome to contact us for your PCB enquiries.