High-Performance RO4003c RF PCB - 1.6mm Thick, Enig Finish

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RO4003c
• Model NO.: BIC-1107-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers/Taconic/Wangling
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

High-Performance RO4003C RF PCB - 1.6mm Thick, 5/4 mil Trace/Space, ENIG Finish
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


Technical Overview
This precision-engineered double-layer PCB utilizes Rogers RO4003C high-frequency laminate to deliver exceptional RF performance in demanding wireless applications. Designed for cellular infrastructure, automotive radar, and satellite communications, the board features an ultra-fine 5/4 mil trace/space capability on a robust 1.6mm thick substrate. The immersion gold finish ensures reliable connectivity while the bare copper construction optimizes high-frequency signal integrity.


PCB Construction Specifications

Category	Parameter
Core Material	Base Substrate
Dimensions	Board Size
Layer Stack	Configuration
Dielectric	Core Thickness
Conductors	Copper Weight
Circuit Density	Trace/Space
Via Technology	Hole Size/Plating
Surface Finish	Final Coating
Thermal Properties	Conductivity
Quality Standards	Compliance

Key Performance Characteristics
Electrical Properties

3.38±0.05 Dielectric Constant at 10GHz for consistent performance

Ultra-low 0.0027 Loss Tangent minimizes signal degradation

Excellent Phase Stability for precise timing applications

CAF Resistant Construction ensures long-term reliability


Mechanical Reliability

CTE Matched to Copper (11/14/46 ppm/°C XYZ axes)

Tg >280°C maintains stability through processing

1.6mm Robust Profile withstands mechanical stress

-40°C to +85°C Operating Range for harsh environments


Manufacturing Advantages

Standard FR-4 Processing reduces fabrication costs

No Special Via Treatments required

Excellent Dimensional Stability simplifies assembly

Competitive Pricing versus PTFE alternatives


Design Specifications


Board Architecture

58 Components with 173 Total Pads (103 PTH, 70 SMT)

114 Interconnecting Vias across 6 Signal Nets

Bare Copper Construction (No solder mask/silkscreen)

Gerber RS-274X File Format


Target Applications
5G Cellular Base Stations
Automotive Radar Systems
Satellite Communication LNBs
RFID Tracking Solutions
Aerospace Avionics


Ordering Information
Prototype Lead Time: 5-7 business days
Production Lead Time: 10-15 business days
Global Availability: Worldwide manufacturing
Quality Documents: IPC-6012 Class 2 reports included




Thank you for your reading and you're welcome to contact us for your PCB enquiries.