Tmm10 2-Layer PCB Board with 94V0 for RF Electronics

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Ceramic Thermoset Polymer Composite
• Model NO.: BIC-1175-V3.0
• Material: Rogers Tmm10
• Application: Aerospace & Defense
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Immersion Silver
• Base Material: Rogers Tmm10
• Insulation Materials: Ceramic Thermoset Polymer Composite
• Brand: Rogers
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Shipping Vacuum Packaging
• Specification: 63mm × 45mm (± 0.15mm)
• Trademark: bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
 

Overview of This Type of PCB

The Rogers TMM10 PCB is a high-performance 2-layer printed circuit board designed for demanding RF and microwave applications. This thermoset microwave material combines the advantages of PTFE and ceramic substrates while overcoming their mechanical limitations. With a high dielectric constant (Dk 9.2 ±0.23 at 10GHz) and excellent thermal stability, it's ideal for strip-line and micro-strip designs requiring precise signal integrity. The material's thermoset resin base ensures reliable wire-bonding and resistance to process chemicals, making it suitable for high-frequency circuits in satellite communications, power amplifiers, and other critical RF systems.

 

 

PCB Construction Details (Summary Table)

Specification	Value
Base Material	TMM10
Layer Count	2 layers
Board Dimensions	63mm × 45mm (±0.15mm)
Minimum Trace/Space	5/5 mils
Minimum Hole Size	0.35mm
Blind Vias	No
Finished Board Thickness	0.6mm
Copper Weight (Outer)	1oz (35μm)
Via Plating Thickness	20μm
Surface Finish	Immersion Silver
Top Silkscreen	White
Bottom Silkscreen	No
Top Solder Mask	Blue
Bottom Solder Mask	No
Electrical Test	100% tested

 

Other Key Components & Features
Stackup:

• Copper Layer 1: 35μm

• TMM10 Core: 0.508mm (20mil)

• Copper Layer 2: 35μm

• 
  PCB Statistics:
  Components:        10
  Total Pads:         20
  Thru Hole Pads:     14
  Top SMT Pads:      6
  Bottom SMT Pads:    0
  Vias:              10
  Nets:              3
   

Material Advantages:

• High Dk Stability: 9.2 ±0.23 at 10GHz

• Low Loss: Dissipation factor of 0.0022 at 10GHz

• Thermal Resilience: Decomposition temp. 425°C (TGA)

• CTE Matched to Copper: 21ppm/K (x,y), 20ppm/K (z)

• Chemical Resistance: Withstands fabrication processes

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• Typical Applications:

• Satellite Communication Systems

• GPS and Patch Antennas

• RF Power Amplifiers

• Microwave Filters

• Dielectric Polarizers

•  

Why Choose This PCB?

• 1.High-Frequency Optimized: Stable Dk for RF designs

• 2.Reliable Bonding: Thermoset resin prevents pad lifting

• 3.Durable Construction: Resists creep and cold flow

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Tags:RF Circuit Board, Microwave PCB, TMM10 Electronics, High-Dk PCB

 

Order Now for:

 

Satellite systems, RF amplifiers, and other high-frequency applications requiring stable dielectric performance.
 

Additional Notes:

Type of artwork supplied: Gerber RS-274-X
Quality standard: IPC-Class-2
Availability: Worldwide