High-Frequency RO4003c PCB - 0.9mm Thick, Enig Finish for RF Applications

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RO4003c
• Model NO.: BIC-1106-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers/Taconic/Wangling
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

High-Frequency RO4003C PCB - 0.9mm Thick, 4/5 mil Trace/Space, ENIG Finish for RF Applications
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


PCB Overview & Key Features
This advanced double-layer PCB utilizes Rogers RO4003C high-frequency laminate to deliver exceptional RF performance with cost-effective manufacturability. Designed for demanding wireless applications, the board combines the electrical benefits of PTFE materials with the processing advantages of standard epoxy/glass substrates. With its 3.38±0.05 dielectric constant and 0.0027 dissipation factor at 10GHz, this solution is ideal for cellular infrastructure, automotive radar, and satellite communications systems.

The design features high-density 4/5 mil trace/space capability across two panel sizes (161.5mm × 163mm), supporting complex RF layouts with 47 components and 151 interconnecting vias. The immersion gold finish ensures reliable solderability while the green solder mask provides protection for sensitive circuits. Filled and capped 0.5mm vias enhance reliability in thermal cycling environments.


Complete PCB Construction Details

Parameter	Specification
Base Material	Rogers RO4003C hydrocarbon/ceramic
Board Configuration	2-layer rigid
Panel Dimensions	161.5mm × 163mm (±0.15mm)
Dielectric Thickness	0.813mm (32mil) core
Finished Thickness	0.9mm
Copper Weight	1oz (35μm) on both layers
Circuit Density	4/5 mil trace/space
Via Technology	0.5mm filled & capped (20μm plating)
Surface Finish	Electroless Nickel Immersion Gold
Solder Mask	Green (Top only)
Silkscreen	White (Top only)
Quality Standards	IPC-Class-2, 100% tested

Material Advantages & Performance Characteristics
1. Superior Electrical Properties

Stable 3.38±0.05 Dk across frequency and temperature variations

Ultra-low 0.0027 loss tangent at 10GHz for minimal signal degradation

Excellent phase stability for precise signal timing requirements

CAF resistant construction for long-term reliability


2. Thermal Management

0.71 W/m/K thermal conductivity for effective heat dissipation

CTE matched to copper (11/14/46 ppm/°C in X/Y/Z axes)

Tg >280°C maintains stability through processing and operation

-40°C to +85°C operating range for harsh environments


3. Manufacturing Benefits

Standard epoxy/glass processes reduce fabrication costs

No special via treatments required unlike PTFE materials

Excellent dimensional stability simplifies multilayer constructions

Competitive pricing versus conventional microwave laminates


Design Specifications

Board Architecture
Component Integration: 47 components (92 thru-hole + 81 SMT pads)

Interconnect Solution: 151 vias across 5 signal networks

Mixed Technology: Supports both through-hole and surface mount components

File Compatibility: Gerber RS-274X format


Quality Assurance
100% electrical testing prior to shipment

IPC-Class-2 compliant construction

Controlled impedance testing available

Cross-section analysis for via quality verification


Target Applications

Cellular base station antennas
RF power amplifiers
5G infrastructure components
Radar collision avoidance
Vehicle-to-everything (V2X) communications
Advanced driver assistance sensors
Low-noise block converters (LNBs)
Phased array antennas
Avionics communication systems


Ordering Information

Standard Deliverables:
IPC-6012 Class 2 compliant boards
Electrical test reports
Material certifications
Panelized or depanelized options

Available Enhancements:
Impedance testing (+10% cost)
TDR testing for critical nets
3D modeling files
Conformal coating

Global Availability:
Manufacturing facilities worldwide
ITAR-compliant options
Export compliance documentation




Thank you for your reading and you're welcome to contact us for your PCB enquiries.