Tc350 2-Layer PCB Board for High-Power Electronics

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: PTFE with Woven Glass Reinforcement
• Model NO.: BIC-1173-V3.0
• Material: Rogers Tc350
• Application: High-Power RF
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: HASL
• Base Material: Rogers Tc350
• Insulation Materials: PTFE with Woven Glass Reinforcement
• Brand: Rogers
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Shipping Vacuum Packaging
• Specification: 68.35mm x 41.4 mm=1PCS
• Trademark: bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
 

Overview of This Type of PCB

The Rogers TC350 PCB is a high-performance 2-layer printed circuit board designed for applications requiring superior thermal management and stable electrical performance. Comprising PTFE, thermally conductive ceramic fillers, and woven glass reinforcement, TC350 laminates offer low insertion loss and high thermal conductivity. This makes them ideal for high-power applications where reliability and reduced operating temperatures are critical. The material's stable dielectric constant across varying temperatures ensures optimal performance in power amplifiers, antennas, and other phase-sensitive devices.

 

 

PCB Construction Details (Summary Table)

Parameter	Specification
Base Material	TC350
Layer Count	2 layers
Board Dimensions	68.35mm × 41.4mm (±0.15mm)
Minimum Trace/Space	6/5 mils
Minimum Hole Size	0.5mm
Blind Vias	No
Finished Thickness	0.6mm
Copper Weight (Outer)	1oz (35µm)
Via Plating Thickness	20µm
Surface Finish	HASL (Hot Air Solder Leveling)
Top/Bottom Silkscreen	No
Solder Mask (Top/Bottom)	Green
Via Treatment	0.5mm vias filled with resin and capped
Electrical Test	100% tested before shipment

 

Other Key Components & Features
Stackup:

• Copper Layer 1: 35µm

• TC350 Core: 0.508mm (20mil)

• Copper Layer 2: 35µm

• 
  PCB Statistics:
  Components:        19
  Total Pads:         48
  Thru Hole Pads:     26
  Top SMT Pads:      22
  Bottom SMT Pads:    0
  Vias:              25
  Nets:              3
   

Material Advantages:

• Thermal Conductivity: 0.72 W/m K for efficient heat dissipation.

• Dielectric Stability: Dk of 3.5 across frequencies (1MHz to 10GHz).

• Low Loss: Dissipation factor as low as 0.0015 at 1MHz.

• Reliability: T260, T288, T300 > 60 minutes for high-temperature endurance.

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• Typical Applications:

• Power Amplifiers and Filters

• Tower Mounted Amplifiers (TMA) and Boosters (TMB)

• Microwave Combiners and Power Dividers

• Thermally Cycled Antennas

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Why Choose This PCB?

• 1.Enhanced Performance: Stable Dk and low loss optimize signal integrity.

• 2.Durability: Excellent plated through-hole reliability and moisture resistance (0.05%).

• 3.Versatility: Suitable for high-power and high-frequency applications.

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Tags:High-Thermal PCB, RF Circuit Board, TC350 Electronics, Power Amplifier PCB

 

Order Now for:

 

Power amplifiers, antennas, and other high-reliability electronics requiring superior thermal and electrical performance.
 

Additional Notes:

Type of artwork supplied: Gerber RS-274-X
Quality standard: IPC-Class-2
Availability: Worldwide