Ltra-Miniature RO3010 RF PCB - 0.2mm Thin, Bare Copper for High-Dk Applications

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RO3010
• Model NO.: BIC-1104-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers/Taconic/Wangling
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

ltra-Miniature RO3010 RF PCB - 0.2mm Thin, 7/7 mil Trace, Bare Copper for High-Dk Applications
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


1. Micro-Scale RF Circuit Board Overview
This revolutionary double-layer PCB utilizes Rogers RO3010 high-Dk laminate to deliver exceptional performance in an ultra-compact 8×8mm form factor. Designed for space-constrained microwave applications, this board represents the cutting edge in circuit miniaturization while maintaining superior RF characteristics.

Key Performance Advantages:
Extreme Miniaturization: 8×8mm footprint with 0.2mm thickness enables new integration possibilities

High-Dk Efficiency: 10.2±0.30 dielectric constant maximizes space utilization

Bare Copper Performance: Unfinished copper maintains optimal RF characteristics

Precision Fabrication: 7/7 mil trace/space with 0.20mm microvias

Thermal Stability: 0.95 W/mK conductivity with 500°C decomposition temperature


2. Technical Specifications

Parameter	Micro-Scale Specification
Core Material	Rogers RO3010 ceramic-PTFE
Board Configuration	Dual-layer ultra-thin construction
Dimensions	8mm × 8mm (0.2mm thickness)
Substrate Thickness	5mil (0.127mm) dielectric core
Copper Weight	1oz (35μm) bare copper
Circuit Precision	7/7 mil trace/space
Microvia Technology	0.20mm minimum laser drill
Surface Treatment	Bare copper (no finish)
Thermal Performance	0.95 W/mK conductivity
Quality Assurance	100% electrical testing

3. Advanced Capabilities & Applications
Breakthrough Material Properties

Broadband Stability: Excellent Dk consistency across frequency spectrum

Moisture Resistance: 0.05% absorption for reliable operation

CTE Matched to Copper: 13/11/16 ppm/°C expansion coefficients

Cost-Effective: Competitive pricing for volume production


Optimized Micro-Board Architecture

Ultra-Compact Design: Single component with 3 pads (2 PTH, 1 SMT)

Micro-Interconnects: 2 precision vias for single net routing

RF-Pure Construction: No solder mask or silkscreen for optimal performance

Manufacturing Ready: Gerber RS-274-X file compatibility



Target Implementations

Micro-Antennas: Compact patch antennas for IoT devices

RFID Tags: Ultra-small wireless identification systems

Medical Implants: Miniature wireless medical devices

Satellite Modules: Space-constrained aerospace electronics


Competitive Advantages

Unmatched Miniaturization: World's smallest high-Dk RF PCB solution

Signal Integrity Focus: Bare copper maintains pristine RF characteristics

Thermal Management: High conductivity in ultra-thin package

Cost Efficiency: Volume production capable


Pushing the Boundaries of RF Miniaturization
Our engineering team specializes in micro-scale RF solutions. Contact us for design support or prototyping of this groundbreaking ultra-compact PCB technology.



Thank you for your reading and you're welcome to contact us for your PCB enquiries.