Megtron 6 M6 Printed Circuit Board PCB of Shenzhen PCB with 94V0

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: M6 R-5775g
• Model NO.: BIC-173-V2.1
• Material: Low Dk Glass Cloth
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Model: PCB
• Brand: Panasonic
• Dk: 3.7
• Layer Count: Multilayer PCB, Hybrid PCB
• Application: Antenna
• Surface Finish: Bare Copper, HASL, Enig, Immersion Silver, etc.
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

M6 High Speed Low Loss Multilayer Printed Circuit Board Megtron 6 PCB
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

Dear PCB friends,
Today, I'd like to introduce you to a remarkable high - speed, low - loss multilayer PCB: the M6 R - 5775 PCB.

Megtron 6 is an exceptional circuit board material renowned for its ultra - low loss characteristics and outstanding heat resistance. Engineered specifically for applications in the mobile, networking, and wireless sectors, among others, it stands out due to its key properties. These include a low dielectric constant (DK) and dielectric dissipation factor (DF), which contribute to minimized signal distortion. Additionally, its low transmission loss ensures efficient signal transfer, while its high heat resistance makes it reliable even under demanding thermal conditions.

Part Numbers
Low Dielectric Constant (Dk) Glass Cloth - Laminate R-5775(N) / PrepregR-5670(N)
Standard E Glass Cloth - Laminate R-5775 / PrepregR-5670

Main Features
Low Dk = 3.7 (@ 1GHz), Low Df = 0.002 (@ 1GHz)
Excellent through-hole reliability (5x better than our conventional high Tg FR4 material)
Lead-free, ROHS-compliant soldering
High heat resistance
M6 also provides excellent high-density interconnect (HDI) and thermal performance.

 

Our PCB Capabilities (Megtron 6)

PCB Capability (Megtron6)
PCB Material:	Low DK Glass Cloth
Designation:	Laminate R-5775(G), Prepreg R-5670(G)
Dielectric constant:	3.61 10GHz
Dissipation Factor	0.004 10GHz
Layer count:	Multilayer PCB, Hybrid PCB
Copper weight:	1oz (35µm), 2oz (70µm)
PCB thickness:	0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.6mm, 1.8mm, 2.0mm
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion silver, Immersion tin, ENEPIG, OSP, Pure gold etc..

 

Main Applications
Antenna (Automotive millimeter wave radar, Base station)
ICT infrastructure equipment
Measuring instrument
Super computer

Typical Value of R-5775

Property			Units	Test Method	Condition	Typical Value
THERMAL	Glass Transition Temp ( Tg )		C	DSC	As received	185
				DMA	As received	210
	Thermal Decomposition Temp		C	TGA	As received	410
	Time to Delam (T288)	Without Cu	Min	IPC TM-650 2.4.24.1	As received	> 120
		With Cu	Min	IPC TM-650 2.4.24.1	As received	> 120
	CTE : α1	X - axis ppm / C	ppm / C	IPC TM-650 2.4.24	< Tg	14 - 16
		Y - axis ppm / C	ppm / C	IPC TM-650 2.4.24	< Tg	14 - 16
		Z - axis ppm / C	ppm / C	IPC TM-650 2.4.24	< Tg	45
	CTE : α2	Z - axis ppm / C	ppm / C	IPC TM-650 2.4.24	> Tg 260	260
ELECTRICAL	Volume Resistivity		M - cm	IPC TM-650 2.5.17.1	C-96/35/90	1 x 109
	Surface Resistivity		M	IPC TM-650 2.5.17.1	C-96/35/90	1 x 108
	Dielectric Constant ( Dk )	@ 1GHz	/	IPC TM-650 2.5.5.9	C-24/23/50	3.71
		@ 10GHz	/	IPC TM-650 2.5.5.5	C-24/23/50	3.61
	Dissipation Factor ( Df )	@ 1GHz	/	IPC TM-650 2.5.5.9	C-24/23/50	0.002
		@ 10GHz	/	IPC TM-650 2.5.5.5	C-24/23/50	0.004
PHYSICAL	Water Absorption		%	IPC TM-650 2.6.2.1	D-24/23	0.14
	Peel Strength	1oz ( H-VLP )	kN / m	IPC TM-650 2.4.8	As Received 0.8	0.8
	Flammability		/	UL	C-48/23/50	94V-0

Megtron 6 Material List in stock (as of September 2021)

Item	Thickness (mil)	Thickness(mm)	Structure	Copper weight(oz)	Type of copper
R5775G	2.0	0.050	1035*1	H/H	HVLP
R5775G	2.6	0.065	1080*1	H/H	HVLP
R5775G	3.0	0.075	1078*1	1.0/1.0	RTF
R5775G	3.0	0.075	1078*1	H/H	RTF
R5775G	3.0	0.075	1078*1	1.0/1.0	HVLP
R5775G	3.0	0.075	1078*1	H/H	HVLP
R5775G	3.9	0.100	3313*1	H/H	RTF
R5775G	3.9	0.100	3313*1	1.0/1.0	RTF
R5775G	5.9	0.150	1080*2	2.0/2.0	RTF
R5775G	9.8	0.250	2116*2	H/H	RTF

 

We can provide you with prototypes, small batches and mass production PCB's. Any questions, please feel free to contact us.

Thanks for your reading.