Advanced RO4450f PCB and Round LED Leiterplatten for for Ultrahigh Frequency Coupler

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: CEM-4
• Model NO.: BIC-069-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Aluminum
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers
• Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil
• Soldermask Color: Blcak, Blue, Yellow, Red, Green...
• Copper Weight: 0.5oz, 1oz, 2oz
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

4 Layer High Frequency PCB On 2 Cores of 32mil 0.813mm RO4003C and 12mil RO4450F for Ultrahigh Frequency Coupler
(Printed circuit boards are custom-made products, the picture and parameters shown are just for reference)

Hello everyone,
Good day.
Today we talk about a type of 4 layer high frequency PCB. This PCB is built on 2 sheets of 0.813mm (32mil) RO4003C cores with 1 sheet RO4450F prepreg for the application of ultrahigh frequency coupler. Following is the stack-up.


In general, multilayer Rogers high frequency PCBs are made from all high frequency material inclusive of prepreg adhesive. As is known to all, there're 6 cores in RO4003C family, i.e. 8mil (0.203mm) to 60mil (1.524mm).
 

RO4003C:
8mil	0.203mm
12mil	0.305mm
16mil	0.406mm
20mil	0.508mm
32mil	0.813mm
60mil	1.524mm

So it's very interesting that stack-up of 4 layers can be done in many different ways.

The specifications of the board are as follows:
Base material: RO4003C 32mil + RO4450F 12mil PP
Layer count: 4 layers
Type: Castellation holes (half holes) on edge
Format: 113mm x 80mm = 1 type = 4 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35 μm/ Inner layer 35 μm
Solder mask / Legend: no / no
Final PCB height: 2.1 mm
Standard: IPC 6012 Class 2
Packing: 20 panels are packed for shipment.
Lead time: 10 working days
Shelf life: 6 months

You enjoy the features and benefits
1) Excellent high frequency performance due to low dielectric tolerance and loss;
2) AOI inspection;
3) Meeting your PCB needs from prototype to mass production;
4) 30000 square meter month capability;
5) 8000 types of PCB's per month;
6) More than 16 years of PCB experience;

Application
GPS antenna, WiFi amplifier, Power amplifier, RF transceiver, TV antenna, Radar data acquisition converter, Spread spectrum, Attenuator

Appendix: Properties of RO4003C

RO4003C Typical Value
Property	RO4003C	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	3.38±0.05	Z		10 GHz/23ºC	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign	3.55	Z		8 to 40 GHz	Differential Phase Length Method
Dissipation Factortan,δ	0.0027 0.0021	Z		10 GHz/23ºC 2.5 GHz/23ºC	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	+40	Z	ppm/ºC	-50ºCto 150ºC	IPC-TM-650 2.5.5.5
Volume Resistivity	1.7 x 10^10		MΩ.cm	COND A	IPC-TM-650 2.5.17.1
Surface Resistivity	4.2 x 10^9		MΩ	COND A	IPC-TM-650 2.5.17.1
Electrical Strength	31.2(780)	Z	Kv/mm(v/mil)	0.51mm(0.020")	IPC-TM-650 2.5.6.2
Tensile Modulus	19,650(2,850) 19,450(2,821)	X Y	MPa(ksi)	RT	ASTM D 638
Tensile Strength	139(20.2) 100(14.5)	X Y	MPa(ksi)	RT	ASTM D 638
Flexural Strength	276 (40)		MPa (kpsi)		IPC-TM-650 2.4.4
Dimensional Stability	<0.3	X,Y	mm/m (mil/inch)	after etch+E2/150ºC	IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion	11 14 46	X Y Z	ppm/ºC	-55ºCto288ºC	IPC-TM-650 2.4.41
Tg	>280		ºC TMA	A	IPC-TM-650 2.4.24.3
Td	425		ºC TGA		ASTM D 3850
Thermal Conductivity	0.71		W/M/^oK	80ºC	ASTM C518
Moisture Absorption	0.06		%	48hrs immersion 0.060" sample Temperature 50ºC	ASTM D 570
Density	1.79		gm/cm^3	23ºC	ASTM D 792
Copper Peel Stength	1.05 (6.0)		N/mm (pli)	after solder float 1 oz. EDC Foil	IPC-TM-650 2.4.8
Flammability	N/A				UL 94
Lead-free Process Compatible	Yes

Thank you for your reading and you're welcome to contact us for your PCB enquires.