Flexible PCB Built on Polyimide with 2 Layers and Pi Stiffener

• Customization: Available
• Structure: Double-Sided FPC
• Material: Polyimide
• Model NO.: BIC-0276-V2.76
• Combination Mode: Adhesive Flexible Plate
• Application: Digital Products, Mobile Phone, Aviation and Aerospace
• Conductive Adhesive: Conductive Silver Paste
• Flame Retardant Properties: V0
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Final Height of PCB: 0.15mm +/-10%
• Final Foil External: 35 Um (1oz)
• Surface Finish: Immersion Gold
• Coverlay Colour: Yellow
• Color of Silkscreen: White
• RoHS Required: Yes
• Function: 100% Pass Electrical Test
• Transport Package: Transparent Bags
• Specification: 45 x 33mm=1PCS21.15 x 58.93mm = 1PCS
• Trademark: Bicheng Enterprise Limited
• Origin: China
• HS Code: 8534009000
• Production Capacity: 50000 Pieces Per Month

Product Description

1.1 General description

This is a type of flexible printed circuit (FPC) for the application of Wi Fi Antenna. It's a 2 layer
flex board at 0.15mm thick. It contains yellow coverlay (solder mask) and without silkscreen on
entire board, and immersion gold is applied on pads. Polyimide as stiffener is applied on the
connector part. The base laminate is from Shengyi and they're fabricated per IPC 6012 Class 2
using supplied Gerber data. Each 200 pieces are packed for shipment.

1.2 Features and benifits
    
A. Excellent flexibility;
B. Reducing the volume;
C. Weight reduction;
D. 8000 types of PCB per month;
E. Quick CADCAM checking and free PCB quotation;
F.  No minimum order quantity. 1 piece is available;
G. Volume Production capability;
H. On-time service;
I.  More than 15 years of experience;

1.3 Application

keypad FPC; Toy lamp strip; Display backlight; Flex keyboard for mobile phone keys; POS
antenna soft board; LCD TV soft board; Digital camera soft board.

1.4 Parameter and data sheet

Number of Layers	2
Outline Dimension	21.15 x 58.93mm = 1PCS
Board Type	Flexible Circuit
Board Thickness	0.15mm +/-10%
Board Material	Polyimide (PI) 50 um
Board Material Supplier	ITEQ
Tg Value of Board Material	60ºC
PTH Cu thickness	≥20 um
Inner Iayer Cu thicknes	N/A
Surface Cu thickness	35 um (1oz)
Coverlay Colour	Yellow
Number of Coverlay	2
Thickness of Coverlay	25 um
Stiffener	200 um
Type of Silkscreen Ink	IJR-4000 MW300
Supplier of Silkscreen	TAIYO
Color of Silkscreen	White
Number of Silkscreen	1
Mininum Trace (mil)	4 mil
Minimum Gap(mil)	4 mil
Surface Finish	Immersion Gold
RoHS Required	Yes
Famability	94-V0
Thermal Shock Test	Pass, -25ºC±125ºC, 1000 cycles.
Thermal Stress	Pass, 300±5ºC,10 seconds, 3 cycles.  No delamination, no blistering.
Function	100% Pass electrical test
Workmanship	Compliance with IPC-A-600H & IPC-6013C Class 2

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