Rogers Rt/Duroid 6035HTC Circuit Board PCB of Shenzhen Designer

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Rt/Duroid 6035HTC
• Model NO.: BIC-1040-V2.1
• Material: Ceramic-Filled PTFE Composite
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Model: PCB
• Brand: Rogers
• Surface Finish: Immersion Silver
• Board Thickness: 0.63mm (Finished)
• Layer Count: 2-Layer
• Solder Mask: Green (Top Only)
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: 89.24mm x 11.8mm (Single Unit)
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

Rogers RT/duroid 6035HTC 2-Layer High-Frequency PCB with 0.63mm Thickness for High-Power RF Amplifiers
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
 

1. Overview of RT/duroid 6035HTC 2-Layer PCB

This high-performance 2-layer PCB utilizes Rogers RT/duroid 6035HTC, a ceramic-filled PTFE composite engineered for high-power RF and microwave applications. With a thermal conductivity of 1.44 W/m·K (2.4x higher than standard RT/duroid 6000 series), RT/duroid 6035HTC PCB significantly reduces operating temperatures in power amplifiers, filters, and combiners. RT/duroid 6035HTC laminate's ultra-low dissipation factor (0.0013 at 10 GHz) and stable dielectric constant (Dk=3.5±0.05) ensure minimal signal loss, even in 5G and radar systems operating above 20 GHz. Designed to meet IPC-Class-2 standards, this board features immersion silver finish and optimized thermal management for mission-critical RF designs.
 

 

2. PCB Construction Details

Parameter	Specification
Base Material	Rogers RT/duroid 6035HTC
Layer Count	2-Layer Rigid
Board Thickness	0.63mm (Finished)
Dimensions	89.24mm x 11.8mm (Single Unit)
Copper Weight	1 oz (35μm) on Outer Layers
Trace/Space Minimum	5/5 mils
Drill Hole Size	0.35mm (Mechanical)
Via Plating Thickness	20 μm
Surface Finish	Immersion Silver
Solder Mask	Green (Top Only)
Silkscreen	None (Top/Bottom)
Testing	100% Electrical Test Pre-Shipment

 

3. Additional Components & Features

Stackup Structure

Layer 1: 35μm Copper

Core: 0.508mm RT/duroid 6035HTC Substrate (Dk=3.5)

Layer 2: 35μm Copper

 

Key Statistics

Components: 128 (81 Thru-Hole, 20 Top SMT, 11 Bottom SMT)

Nets: 6

Vias: 100 (Through-Hole Only)

 

Technical Specifications

Artwork Format: Gerber RS-274-X

CTE: X/Y/Z = 19/19/39 ppm/°C

Moisture Absorption: 0.06%

Thermal Stability: Maintains Dk within ±0.05 from -40°C to +150°C

 

Benefits

High Power Handling: Supports 100W+ RF amplifiers with 40% lower hotspot temperatures.

Low Insertion Loss: <0.1dB/inch at 20GHz for millimeter-wave applications.

Drillability: Advanced ceramic filler reduces machining costs by 25% vs alumina-filled laminates.
 

Applications

5G base station power amplifiers

Military radar couplers and combiners

Satellite communication filters

Industrial RF heating systems
 

Why Choose This PCB?
The RT/duroid 6035HTC PCB's 1.44 W/m·K thermal conductivity and -66 ppm/°C Dk thermal coefficient make it ideal for high-power density designs. Its immersion silver finish ensures solder joint reliability across 500+ thermal cycles, while the green solder mask aids visual inspection in automated assembly lines.

Tags: RT/duroid 6035HTC PCB, 2-Layer RF Board, 0.63mm Thickness PCB, High-Power Amplifier Circuit, Microwave Filter Substrate.

Power Your RF Systems with Unmatched Thermal Efficiency!
Engineers trust this PCB for 28 GHz 5G PA modules and X-band radar arrays-where thermal management and signal integrity are critical. Contact us today to leverage its military-grade stability and global availability for your next high-frequency project!