RO4835 6-Layer Hybrid PCB with 1.20mm Thickness for Automotive Radar & Microwave Systems
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
1. Overview of RO4835 6-Layer Hybrid PCB
This advanced 6-layer hybrid PCB combines Rogers RO4835 high-frequency laminates with High Tg 170°C FR-4 cores, engineered for demanding RF and microwave applications. Designed for automotive radar (77 GHz), phased-array systems, and power amplifiers, RO4835 PCB delivers a stable dielectric constant (Dk=3.48±0.05) and ultra-low dissipation factor (0.0037 at 10 GHz), ensuring minimal signal loss in harsh environments. Featuring ENIG surface finish and 90Ω impedance control on critical traces, this board meets IPC-Class-2 standards while supporting high-volume manufacturing. Its hybrid stackup balances cost efficiency and performance, making it ideal for 5G infrastructure and automotive ADAS sensors.
2. PCB Construction Details
| Parameter |
Specification |
| Base Material |
RO4835 + High Tg FR-4 |
| Layer Count |
6-Layer Rigid Hybrid |
| Board Thickness |
1.20mm (Finished) |
| Dimensions |
56.4mm x 54mm (Single Unit) |
| Copper Weight |
1 oz (35μm) All Layers |
| Trace/Space Minimum |
4/4 mils |
| Drill Hole Size |
0.20mm (Mechanical) |
| Via Plating Thickness |
20 μm |
| Surface Finish |
ENIG (Electroless Nickel Immersion Gold) |
| Solder Mask |
Green (Top/Bottom) |
| Silkscreen |
White (No Overlap on Pads) |
| Blind Vias |
L1-L2 |
| Impedance Control |
90Ω @ 14mil Trace (Top Layer, Ref: L2) |
| Testing |
100% Electrical Test Pre-Shipment |
- Additional Components & Features
Stackup Structure: 6-layer rigid PCB
Copper Layer-1 35 micron
RO4835 Core 0.1016mm (4mil)
Copper Layer-2 35 micron
Prepreg High Tg 0.254mm
Copper Layer-3 35 micron
FR-4 Core High Tg 0.254mm
Copper Layer-4 35 micron
Prepreg High Tg 0.254mm
Copper Layer-5 35 micron
FR-4 Core High Tg 0.1016mm (4mil)
Copper Layer-6 35 micorn
Key Statistics
Components: 81 (77 Thru-Hole, 43 Top SMT, 21 Bottom SMT)
Nets: 19
Vias: 151 (Including L1-L2 Blind Vias)
Technical Specifications
Artwork Format: Gerber RS-274-X
CTE: X/Y/Z = 10/12/31 ppm/°C
Tg: >280°C (TMA Method)
RoHS Compliance: UL 94 V-0 Certified
Benefits
High Thermal Resilience: Withstands automotive under-hood temperatures (-40°C to +150°C).
Low Z-CTE (31 ppm/°C): Ensures plated through-hole reliability over 1,000+ thermal cycles.
Cost-Effective Hybrid Design: Combines RO4835's RF performance with FR-4's affordability.
Applications
Automotive radar (77 GHz ADAS/AV systems)
5G millimeter-wave base stations
Satellite communication LNBs
Military phased-array antennas
Why Choose This PCB?
Engineered for mission-critical RF systems, this RO4835 hybrid PCB bridges PTFE's performance and FR-4's manufacturability. The ENIG finish and blind vias (L1-L2) ensure precision in high-density designs, while green solder mask enhances inspection accuracy. With global availability and IPC-certified quality, it reduces prototyping costs by 25% versus traditional microwave laminates.
Tags: RO4835 PCB, 6-Layer Hybrid Board, 1.20mm Thickness PCB, Automotive Radar Circuit, Microwave Power Amplifier, Rogers RO4835.
Act Now to Power Your RF Innovations!
Perfect for engineers designing next-gen radar and 5G infrastructure, this PCB delivers military-grade reliability at commercial pricing. Contact us today to leverage its hybrid stackup and impedance-controlled performance-your precision microwave solution awaits!
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