| Customization: | Available |
|---|---|
| Type: | Rigid Circuit Board |
| Dielectric: | Ceramic Thermoset Polymer Composite |
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(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
The 2-layer TMM3 PCB is a specialized microwave circuit board designed for high-reliability RF applications. Featuring Rogers' TMM3 ceramic thermoset polymer composite, this PCB offers excellent electrical performance with a 1.6mm finished thickness and 1oz copper weight. The board supports 7/7 mil trace/space requirements and 0.45mm minimum hole sizes, making it suitable for various microwave components.
Key features include:
HASL surface finish for reliable solderability
White silkscreen on top layer only for component identification
Green solder mask on top layer with bare bottom layer
100% electrical testing prior to shipment
12-up panel configuration (155.1mm × 168.12mm, ±0.15mm)
| Parameter | Specification |
|---|---|
| Base Material | Rogers TMM3 |
| Layer Count | Double-sided (2-layer) |
| Board Dimensions | 155.1mm × 168.12mm (±0.15mm) panel (12-up) |
| Minimum Trace/Space | 7/7 mils |
| Minimum Hole Size | 0.45mm |
| Finished Thickness | 1.6mm |
| Copper Weight | 1oz (35µm) outer layers |
| Via Plating Thickness | 20µm |
| Surface Finish | HASL |
| Silkscreen | White (Top), None (Bottom) |
| Solder Mask | Green (Top), None (Bottom) |
| Electrical Test | 100% tested prior to shipment |
Copper Layer 1: 35µm
Rogers TMM3 Core: 1.524mm (60mil)
Copper Layer 2: 35µm
Excellent RF Performance: Dk 3.27 ±0.032 with low loss (0.0020) at 10GHz
Thermal Stability: CTE matched to copper (15/15/23 ppm/K in x/y/z)
Process Advantages: No sodium napthanate treatment required
Reliability: Resistant to creep, cold flow, and process chemicals
Wire Bonding: Thermoset resin base enables reliable wire bonding
Typical Applications
RF/Microwave Circuits: Power amplifiers, combiners, filters
Satellite Systems: GPS antennas, communication equipment
Test Equipment: Chip testers and measurement devices
Antenna Systems: Patch antennas, dielectric components
Proven RF Performance: Stable dielectric properties across frequencies
Manufacturing Efficiency: Simplified processing vs. traditional PTFE materials
Reliable Construction: High plated through-hole reliability
Cost Effective: Combines ceramic and PTFE benefits at competitive cost
Global Availability: IPC-Class-2 compliant boards shipped worldwide
Upgrade your high-frequency designs with our TMM3 2-layer PCB - the reliable choice for demanding RF applications.
Ideal for:
• Satellite communication systems
• RF power amplifiers
• Microwave test equipment
• Aerospace electronics
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