| Customization: | Available |
|---|---|
| Type: | Rigid Circuit Board |
| Dielectric: | Woven Glass Reinforced Hydrocarbon/Ceramic Composi |
Suppliers with verified business licenses
Audited Supplier Audited by an independent third-party inspection agency
(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
The 2-layer RO4003C PCB is a cost-effective, high-frequency circuit board designed for demanding RF applications. Featuring a 0.9mm finished thickness and 1oz copper weight, this PCB utilizes Rogers' proprietary woven glass reinforced hydrocarbon/ceramic material that combines PTFE-like performance with epoxy/glass manufacturability. With 5/5 mil trace/space capability and 0.45mm minimum hole size, it supports high-density RF designs. The immersion gold surface finish ensures excellent conductivity, while the green solder mask on top layer provides basic protection.
| Parameter | Specification |
|---|---|
| Base Material | RO4003C |
| Layer Count | Double-sided (2-layer) |
| Board Dimensions | 335.15mm × 150.8mm (±0.15mm) |
| Minimum Trace/Space | 5/5 mils |
| Minimum Hole Size | 0.45mm |
| Finished Thickness | 0.9mm |
| Copper Weight | 1oz (35µm) outer layers |
| Via Plating Thickness | 25µm |
| Surface Finish | Immersion Gold |
| Solder Mask | Green (Top), None (Bottom) |
| Silkscreen | None |
| Electrical Test | 100% tested prior to shipment |
Copper Layer 1: 35µm
RO4003C Core: 32mil (0.813mm)
Copper Layer 2: 35µm
Excellent RF Performance: Dk of 3.38 ±0.05 at 10GHz with low loss (0.0027)
Thermal Stability: Tg >280°C, Td >425°C with CTE matched to copper (11/14/46 ppm/°C)
Manufacturing Efficiency: Uses standard epoxy/glass processes - no special treatments needed
Dimensional Stability: Low Z-axis expansion ensures reliable plated through-holes
Cost Effective: Fraction of the cost of conventional microwave laminates
Typical Applications
Telecommunications: Cellular base station antennas and power amplifiers
Automotive: Radar systems and collision avoidance sensors
Satellite: LNBs for direct broadcast satellites
IoT: RF identification tags and wireless sensors
Optimal Price/Performance: High-frequency capability at economical cost
Design Flexibility: Supports complex RF circuits with tight tolerances
Thermal Reliability: Withstands high processing and operating temperatures
Production Friendly: Compatible with standard PCB fabrication processes
Global Availability: IPC-Class-2 compliant boards shipped worldwide
Upgrade your wireless designs with our RO4003C 2-layer PCB - the optimal balance of performance and affordability for high-volume RF applications.
Ideal for:
• 5G base station components
• Automotive radar systems
• Satellite communication devices
• Industrial IoT sensors
){kind=link}