RO4003C 6-Layer Hybrid PCB with 1.10mm Thickness for RF & Automotive Radar System
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
1. Overview of RO4003C 6-Layer Hybrid PCB
This advanced 6-layer hybrid PCB combines Rogers RO4003C high-frequency laminates with High Tg 170°C FR-4 cores, engineered for high-performance RF and microwave applications. Designed for cellular base stations, automotive radar systems, and satellite communications, it delivers a stable dielectric constant (Dk=3.38±0.05 at 10 GHz) and ultra-low dissipation factor (0.0027), minimizing signal loss in demanding environments. With 50Ω impedance control on critical traces and ENIG surface finish, this board ensures reliable signal integrity while meeting IPC-Class-2 standards. Its hybrid stackup optimizes cost-efficiency without compromising RF performance, making it ideal for high-volume, mixed-signal designs.
2. PCB Construction Details
| Parameter |
Specification |
| Base Material |
RO4003C + High Tg FR-4 |
| Layer Count |
6-Layer Rigid Hybrid |
| Board Thickness |
1.10mm (Finished) |
| Dimensions |
76mm x 54mm (Single Unit) |
| Copper Weight |
1 oz (35μm) All Layers |
| Trace/Space Minimum |
5/4 mils |
| Drill Hole Size |
0.20mm (Mechanical) |
| Via Plating Thickness |
20 μm |
| Surface Finish |
ENIG (Electroless Nickel Immersion Gold) |
| Solder Mask |
Matte Blue (Top/Bottom) |
| Silkscreen |
White (No Overlap on Pads) |
| Via Treatment |
0.25/0.2mm Vias Resin-Filled (IPC-4761 Type VII) |
| Impedance Control |
50Ω @ 20mil Trace (Top Layer, Ref: L2) |
| Testing |
100% Electrical Test Pre-Shipment |
3. Additional Components & Features
Stackup Structure: 6-layer rigid PCB
Copper Layer-1 35 micron
RO4003C Core 0.305mm (12mil)
Copper Layer-2 35 micron
Prepreg High Tg 0.0762mm
Copper Layer-3 35 micron
FR-4 Core High Tg 0.18mm
Copper Layer-4 35 micron
Prepreg High Tg 0.0762mm
Copper Layer-5 35 micron
RO4003C Core 0.305mm (12mil)
Copper Layer-6 35 micron
Key Statistics
Components: 112 (89 Thru-Hole, 50 Top SMT, 47 Bottom SMT)
Nets: 8
Vias: 185 (Resin-Filled, No Blind/Buried)
Technical Specifications
Artwork Format: Gerber RS-274-X
Thermal Conductivity: 0.71 W/m·K
CTE: X/Y/Z = 11/14/46 ppm/°C
Moisture Absorption: 0.06%
Benefits
Cost-Effective Hybrid Design: Combines RO4003C's RF performance with FR-4's affordability.
Dimensional Stability: CTE matched to copper (X/Y: 11/14 ppm/°C) for reliable multi-layer builds.
High Thermal Resilience: Operates at >280°C Tg, suitable for automotive under-hood environments.
Applications
5G base station power amplifiers
Automotive radar (77GHz ADAS)
Satellite LNB modules
RFID tag antennas
Why Choose This PCB?
Engineered for high-volume RF systems, this RO4003C hybrid PCB bridges the gap between PTFE's performance and FR-4's manufacturability. The resin-filled vias and ENIG finish ensure durability in harsh conditions, while the matte blue solder mask enhances inspection accuracy. With global availability and seamless FR-4-compatible processing, it reduces prototyping costs by 30% compared to traditional microwave laminates.
Tags: RO4003C PCB, 6-Layer Hybrid Board, 1.10mm Thickness PCB, Automotive Radar Circuit, RF Power Amplifier PCB, Rogers RO4003C.
Act Now for High-Frequency Excellence!
Perfect for engineers designing next-gen radar and 5G infrastructure, this PCB delivers military-grade reliability at commercial pricing. Request a quote today to leverage its hybrid stackup and impedance-controlled performance for your mission-critical projects!
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