Fr-4 PCB Spacer Blank Board Built on 1.5mm Fiber Glass

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: BIC-862-V8.62
• Material: Fiberglass Epoxy
• Application: Consumer Electronics
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Board Thick: 1.5mm +/-0.15
• Surface Finish: No Required
• out Layer Copper: No Required
• Soldermask Color: No Required
• Silkscreen Color: No Required
• Mininum Trace (Mil): No Required
• Minimum Gap(Mil): No Required
• RoHS Required: Yes
• Warpage: 0.15%
• Test: 100% Electrical Test
• Transport Package: Vacuum
• Specification: 99.79mm x 75.67mm =1up
• Trademark: Bicheng Enterprise Limited
• Origin: China
• HS Code: 8534009000
• Production Capacity: 50000 PCS/ Month

Product Description

1.1 General description

This is a type of PCB spacer built on FR-4 substrate with Tg 135°C for the application of Portable
Transceiver. It's 1.5 mm thick without copper pattern, no silkscreen and solder mask and surface
finish either. The base material is from ILM supplying single PCB per panel. They're fabricated
per IPC 6012 Class 2 using supplied Gerber data. Each 25 boards are packed for shipment. 

1.2 Features and benifits 
   
a. Lead free assemblies with a maximum reflow temperature of 260ºC;
b. It's suitable for handheld and consumer applications;
c. Delivery on time. Higher than 98% on-time-delivery rate;
d. Products and Manufacturing are certified by authorized organizations;
e. Hassle-free, one-to-one after-sales service;
f.  Coupon policy for new customer;
g. No MOQ, low cost for prototypes and small runs quantity;
h. Free stencil shim sent for new user.

1.3 Application

Car GPS, GPS Navigator, Bluetooth GPS, Access Control System, Unmanaged Switch, Wireless
Printer Adapter, DC DC Step Up Converter, HMI PLC, Access Control Equipment, Industrial
controls.

1.4 Parameter and data sheet

Number of Layers	N/A
Board Type	Blank Spacer
Board Size	99.79 x 75.67 mm =1UP
Board Thickness	1.5mm +/-0.15
Board Material	FR-4
Board Material Supplier	ILM
Tg Value of Board Material	TG135ºC
PTH Cu thickness	N/A
Inner Iayer Cu thicknes	N/A
Surface Cu thickness	N/A
Solder Mask Type and Model No.	N/A
Solder Mask Supplier	N/A
Solder Mask Colour	N/A
Number of Solder Masks	N/A
Thickness of Solder Mask	N/A
Type of Silkscreen Ink	N/A
Supplier of Silkscreen	N/A
Color of Silkscreen	N/A
Number of Silkscreen	N/A
Mininum Trace (mil)	N/A
Minimum Gap(mil)	N/A
Surface Finish	N/A
RoHS Required	Yes
Warpage	0.15%
Thermal Shock Test	Pass, 288±5ºC,10 seconds, 3 cycles.  No delamination, no blistering.
Solderablity Test	N/A
Function	visual inspection
Workmanship	Compliance with IPC-A-600H & IPC-6012C Class 2