High-Performance Ad250c PCB - 1.6mm Thick Double-Sided RF Board

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Ad250c
• Model NO.: BIC-1030-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers/Taconic/Wangling
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

High-Performance AD250C PCB - 1.6mm Thick Double-Sided RF Board
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


1. Premium RF Circuit Board Solution
This advanced double-sided PCB utilizes Rogers AD250C laminate, a high-performance material specifically engineered for modern telecommunication infrastructure. Designed for cellular base station antennas and automotive telematics systems, this 1.6mm thick board delivers exceptional signal integrity with its ultra-low 0.0013 loss tangent at 10GHz and outstanding passive intermodulation (PIM) performance (-159 dBc).

Key Advantages:
Superior RF Performance: 2.5±0.05 dielectric constant for stable signal transmission
Enhanced Current Capacity: 2oz copper layers (70μm) for power applications
Thermal Reliability: >500°C decomposition temperature withstands harsh conditions
Manufacturing Efficiency: Compatible with standard PTFE processing

2. Technical Specifications

Parameter	Specification
Base Material	Rogers AD250C PTFE Composite
Layer Configuration	Double-Sided
Board Dimensions	171mm × 76mm (±0.15mm)
Finished Thickness	1.6mm (60mil dielectric)
Copper Weight	2 oz (70μm) all layers
Minimum Trace/Space	4/4 mils
Minimum Hole Size	0.35mm
Via Count	97
Surface Finish	Immersion Gold
Solder Mask	Green (Top only)
Component Density	167 components (122 thru-hole, 89 SMT)

3. Engineering Features & Applications
Advanced Material Properties
Exceptional PIM Performance: -159 dBc for clean signal transmission
Environmental Resistance: Only 0.04% moisture absorption
Thermal Stability: CTE of 47/29/196 ppm/°C (X/Y/Z)
Dimensional Consistency: Excellent for large-panel manufacturing

Design Capabilities
High-Power Support: 2oz copper for current-intensive designs
Precision Layout: 4/4 mil trace/space technology
Reliable Interconnects: 97 plated through holes
File Compatibility: Gerber RS-274-X format


Target Applications
5G Infrastructure: Massive MIMO antenna arrays
Automotive Systems: Telematics and V2X antennas
Satellite Technology: High-performance radio antennas
Wireless Networks: Base station components

Competitive Advantages:
1. Industry-Leading Low Loss for maximum signal integrity
2. Superior PIM Characteristics for antenna applications
3. Enhanced Power Handling with 2oz copper layers
4. Cost-Effective Manufacturing without performance compromise


Request Your Custom RF Solution
Our engineering team can adapt this platform for your specific antenna requirements, offering global manufacturing support and technical consultation for high-frequency projects.





Thank you for your reading and you're welcome to contact us for your PCB enquiries.