6-Layer It-180A HDI PCB Board with 94V0 for Advanced Electronics and Networking

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: It-180atc
• Model NO.: BIC-1098-V3.0
• Material: Iteq It-180atc
• Application: Data Storage
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Enig
• Base Material: It-180atc Fr-4
• Insulation Materials: Fr-4
• Brand: Iteq
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Shipping Vacuum Packaging
• Specification: 113mm x 90mm
• Trademark: bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
 

Overview of This Type of PCB

The 6-layer IT-180A HDI PCB is a high-density interconnect printed circuit board designed for demanding applications in automotive, networking, and telecommunications. Featuring any-layer interconnection technology and ultra-thin 0.66mm profile, this electronics board delivers superior signal integrity and thermal performance for high-speed circuit board designs.

 

 

PCB Construction Details (Summary Table)

Parameter	Specification
Base Material	IT-180
Layer Count	6 layers
Board Dimensions	113mm × 90mm (20PCS)
Tolerance	±0.15mm
Minimum Trace/Space	3/4 mils
Minimum Hole Size	0.10mm (laser drill)
Via Types	Blind vias and buried vias (interconnected L1-L2, L2-L3, L3-L4, L4-L5, L5-L6)
Finished Board Thickness	0.66mm
Finished Cu Weight	1 oz (35μm) each layer
Via Plating Thickness	20μm
Surface Finish	ENIG (Electroless Nickel Immersion Gold)
Silkscreen	White (Top & Bottom)
Solder Mask	Green (Top & Bottom)
Silkscreen Restriction	Forbidden on solder pads
Via Treatment	0.25mm and 0.2mm vias filled by resin and capped (IPC-4761 Type VII)
Impedance Control	100Ω on top layer (6mil trace, reference L2)
Special Features	Castellated holes/half holes
Quality Assurance	100% Electrical test prior to shipment

 

Other Key Components & Features
Stackup:

• Layer 1: 35µm Cu

• Prepreg 1080: 0.075mm

• Layer 2: 35µm Cu

• Prepreg 106 (72%) x2: 0.0614mm

• Layer 3: 35µm Cu

• FR-4 Core (High Tg): 0.10mm

• Layer 4: 35µm Cu

• Prepreg 106 (72%) x2: 0.0614mm

• Layer 5: 35µm Cu

• Prepreg 1080: 0.075mm

• Layer 6: 35µm Cu

• 
  PCB Statistics:
  Total Pads:         153
  Thru Hole Pads:     78
  Top SMT Pads:      39
   Bottom SMT Pads:    36
   Vias:              94
   Nets:              7
   

Material Advantages:

• High Thermal Resilience: Tg 175°C, Td 345°C.

• Low Signal Loss: Dk 4.4 / Df 0.0015 @1GHz.

• CAF-Resistant: Reliable for high-voltage applications.

• Ultra-Thin: 0.66mm profile with HDI capabilities.

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• Typical Applications:

• Automotive ECUs (engine control units)

• High-speed server backplanes

• 5G telecommunications hardware

• Data storage systems

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Why Choose This PCB?

• Any-layer HDI for complex routing.

• IPC-Class-2 compliant with rigorous testing.

• Optimized for impedance control in high-frequency designs.

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Tags:HDI PCB, High-Speed Circuit Board, IT-180 Material, Automotive Electronics

 

Order Now for Reliable PCB Manufacturing

Cutting-edge PCB manufacturing solutions for networking, automotive, and high-performance electronic board applications.
 

Additional Notes:

Type of artwork supplied: Gerber RS-274-X
Quality standard: IPC-Class-2
Availability: Worldwide