| Customization: | Available |
|---|---|
| Type: | Flexible Circuit Board |
| Dielectric: | Polyimide |
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(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
In the world of compact and flexible electronics, the Flexible PCB with Polyimide Stiffener is a versatile solution designed for applications requiring both flexibility and structural support. This single-layer flexible printed circuit (FPC) is built on a 0.2mm thick base laminate from Shengyi and is manufactured to IPC 6012 Class 2 standards. With a polyimide (PI) stiffener applied to the inserting head, this FPC is ideal for wireless dongles, mobile phone antennas, and other compact electronic devices.
Key Features of Flexible PCB with PI Stiffener
1.Excellent Flexibility: The FPC can be bent, folded, and wound, making it ideal for applications where space and flexibility are critical.
2.Reduced Volume and Weight: By using FPC, the overall volume and weight of electronic products can be significantly reduced, enabling the development of smaller and lighter devices.
3.Increased Reliability:The polyimide stiffener provides additional structural support, enhancing the durability and reliability of the circuit.
4.Low Cost: The FPC offers a cost-effective solution for low to medium volume production, making it an economical choice for various applications.
5.Consistency in Assembly: The FPC ensures consistent assembly quality, reducing the risk of errors during production.
6.More Than 20 Years of Experience: With decades of expertise in PCB manufacturing, we deliver high-quality FPCs tailored to your needs.
Parameter and Data Sheet
| Size of Flexible PCB | 230.5 X 40.8mm |
| Number of Layers | 1 |
| Board Type | Flexible PCB |
| Board Thickness | 0.20mm |
| Board Material | Polyimide (PI) 25µm |
| Board Material Supplier | ITEQ |
| Tg Value of Board Material | 60ºC |
| PTH Cu thickness | ≥20 µm |
| Inner Iayer Cu thicknes | N/A |
| Surface Cu thickness | 35µm (1oz) |
| Coverlay Colour | Yellow |
| Number of Coverlay | 1 |
| Thickness of Coverlay | 25 µm |
| Stiffener Material | Polyimide |
| Stiffener Thickness | 0.2mm |
| Type of Silkscreen Ink | IJR-4000 MW300 |
| Supplier of Silkscreen | TAIYO |
| Color of Silkscreen | White |
| Number of Silkscreen | 1 |
| Peeling test of Coverlay | No peelable |
| Legend Adhesion | 3M 90ºC No peeling after Min. 3 times test |
| Surface Finish | Immersion Gold |
| Thickness of Nickle/Gold | Au: 0.03µm(Min.); Ni 2-4µm |
| RoHS Required | Yes |
| Famability | 94-V0 |
| Thermal Shock Test | Pass, -25ºC±125ºC, 1000 cycles. |
| Thermal Stress | Pass, 300±5ºC,10 seconds, 3 cycles. No delamination, no blistering. |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 2 |
Applications
The Flexible PCB with PI Stiffener is well-suited for a variety of applications, including:
Wireless Dongles: Ideal for compact and lightweight designs in wireless communication devices.
Mobile Phone Built-in Antenna FPC: Ensures reliable performance in mobile devices.
Flex Keyboard for Mobile Phone Keys: Suitable for flexible and durable keypad designs.
Industrial Control Computer Soft Boards: Perfect for flexible connections in industrial control systems.
Why Choose Flexible PCB with PI Stiffener?
1.Versatility: The FPC can be used in a wide range of applications, from consumer electronics to industrial devices.
2.Structural Support: The polyimide stiffener provides additional rigidity where needed, ensuring the FPC can withstand mechanical stress.
3.Cost-Effective: The FPC offers a low-cost alternative to traditional rigid PCBs, making it an economical choice for low to medium volume production.
4.High Reliability: Manufactured to IPC 6012 Class 2 standards, the FPC ensures high quality and reliability.
5.Global Availability: Ready to ship worldwide, ensuring timely delivery for your projects.
Stiffener Materials
In many applications where components are soldered, flexible boards require external stiffeners for additional support. Common stiffener materials include:
1.Polyimide (PI) or Polyester Film: Commonly used for their balance of flexibility and rigidity. Typical thickness is 125μm (5mil).
2.Glass Fibers (e.g., FR-4): Offers higher hardness compared to PI or polyester, suitable for applications requiring greater rigidity. Thickness ranges from 125μm (5mil) to 3.175mm (125mils).
3.Polymer Materials: Known for low water absorption and high resistance to pressure and temperature.
4.Steel Foil and Aluminum Shim: Provides high hardness and heat dissipation, ideal for designs where mechanical strength and thermal management are critical.
Conclusion
The Flexible PCB with Polyimide Stiffener is a high-performance, cost-effective solution designed for applications requiring both flexibility and structural support. With its excellent flexibility, increased reliability, and low cost, it is an ideal choice for engineers working on wireless dongles, mobile phone antennas, and industrial control systems.
Whether you're designing for consumer electronics or specialized industrial applications, the Flexible PCB with PI Stiffener offers the reliability and performance you need to bring your projects to life.
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