| Customization: | Available |
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| Type: | Rigid Circuit Board |
| Dielectric: | Megtron® M6 |
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(Custom-manufactured PCBs tailored to your high-frequency design requirements. Images and specs are illustrative.
Product Overview
Our 12-Layer High-Speed PCB leverages Panasonic's Megtron® M6 material to deliver ultra-low signal loss (Dk=3.61, Df=0.004 @10GHz) and precision 50Ω impedance control for 5G, RF, and networking systems. Featuring a 2.5mm thickness, ENIG (Immersion Gold) finish, and resin-filled microvias, this multilayer PCB ensures superior signal integrity, thermal stability (Td 410°C), and HDI (High-Density Interconnect) performance.
Key Features & Benefits
1. High-Frequency Performance
Ultra-Low Loss Material:
Megtron® M6 with Dk=3.61/Df=0.004 minimizes attenuation in high-speed PCBs (>10GHz).
50Ω impedance control on critical layers (L3, L10) for RF/wireless applications.
Advanced PCB Via Technology:
Blind/buried vias (GTL-L2, L3-L8, L3-GBL) and resin-filled microvias (≤0.4mm) for reliability.
2. High-Density & Durable Design:
4/4 mil trace/space and 0.3mm minimum hole size for complex layouts.
12-layer stackup: 5 cores + 6 prepreg layers with 17µm (inner) / 35µm (outer) copper.
5x better through-hole reliability vs. standard FR4; ROHS-compliant for lead-free assembly.
3. Certified Quality
100% electrical tested (zero defects).
IPC-Class-3 certified for aerospace/medical-grade reliability.
Technical Specifications
Parameter Specification
Base Material: Megtron® M6 (R-5775G core + R-5670G prepreg)
Layer Count: 12 layers
Dimensions: 214mm x 65mm (±0.15mm)
Board Thickness: 2.5mm
Copper Weight: Inner: 0.5oz (17μm) / Outer: 1oz (35μm)
Surface Finish: ENIG (Immersion Gold)
Solder Mask: Green (top & bottom)
Silkscreen: White (top & bottom)
Via Plating Thickness: 25μm
SPCS
| PCB SIZE | 214 x 65mm=1PCS |
| BOARD TYPE | |
| Number of Layers | 12-layer Rigid PCB |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 35um(1oz) |
| Prepreg R-5670(G) 3313(57%) X 1 | |
| copper ------- 35um(1oz) | |
| Core R5775G (HVLP) 0.1mm | |
| Copper ------- 17um(0.5oz) | |
| Prepreg R-5670(G) 1035(70%) X 2 | |
| ............. | |
| Prepreg R-5670(G) 3313(57%) X 1 | |
| copper ------- 35um(1oz) | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 4mil/4mil |
| Minimum / Maximum Holes: | 0.3mm / 0.8mm |
| Number of Different Holes: | 17 |
| Number of Drill Holes: | 351 |
| Number of Milled Slots: | 4 |
| Number of Internal Cutouts: | 4 |
| Impedance Control | Yes |
| BOARD MATERIAL | |
| Glass Epoxy: | Core R5775G (HVLP) 0.1mm |
| Final foil external: | 1.0 oz |
| Final foil internal: | 0.5 oz / 1 oz |
| Final height of PCB: | 2.5 mm ±0.1 |
| PLATING AND COATING | |
| Surface Finish | Immersion Gold |
| Solder Mask Apply To: | Green |
| Solder Mask Color: | Green |
| Solder Mask Type: | LPI |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | White |
| Colour of Component Legend | White |
| Manufacturer Name or Logo: | N/A |
| VIA | Plated Through Hole(PTH), Blind via, Buried via |
| FLAMIBILITY RATING | 94 V-0 |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
PCB Stackup Structure
Layer 1: 35μm Cu
Prepreg R-5670G 3313(57%)
Layer 2: 35μm Cu
Core R5775G(HVLP) 0.1mm
Layer 3: 17μm Cu
Prepreg R-5670G 1035(70%)×2
... (Layers 4-11 optimized for signal/power integrity) ...
Layer 12: 35μm Cu
Why Choose This 12-Layer PCB?
Low Dk/Df: Critical for 5G/mmWave/radar PCBs.
HDI-Compatible: Supports miniaturized high-performance devices.
Global Standards: Complies with IPC-4101/102/91.
Applications
5G/Wireless: Base stations, antenna arrays, RF modules.
Networking: High-speed servers, routers, switches.
Industrial: IC testers, aerospace PCBs, medical imaging.
Order Now
File Formats: Gerber RS-274-X (Altium/Cadence compatible).
Lead Time: Prototyping + bulk production (global shipping).
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