Rogers Rt Duroid 5880lz Circuit Board PCB of Shenzhen Designer

• Customization: Available
• Structure: Multilayer Rigid PCB
• Dielectric: Rt Duroid 5880lz
• Model NO.: BIC-191-V2.1
• Material: Unique Filled PTFE Composites
• Application: Stripline and Microstrip
• Flame Retardant Properties: V0
• Processing Technology: Electrolytic Foil
• Production Process: Subtractive Process
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Brand: Rogers
• Surface Finish: Bare Copper, HASL, Enig, Immersion Silver, etc.
• Laminate Thickness: 10mil 20mil 50mil and 100mil
• Layer Count: Single Sided, Double Sided, Multilayer PCB, Hybrid
• Dielectric Constant: 2
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

Rogers RT duroid 5880LZ High Frequency PCB 10mil 20mil 50mil and 100mil RT5880LZ PCB
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

General Description
Rogers RT duroid 5880LZ PCBs are specialized PTFE composites, meticulously engineered for precise stripline and microstrip circuit applications. Thanks to their distinctive filler composition,  RT duroid 5880LZ laminates are low in density and lightweight, making them ideal for high - performance applications where weight is a critical factor.

One of the key advantages of RT duroid 5880LZ PCBs  is their extremely low dielectric constant. This value remains highly consistent across different panels, ensuring reliable and uniform performance. Moreover, the dielectric constant stays stable over a broad frequency spectrum. Complemented by a low dissipation factor, 5880LZ laminates are suitable for use in applications operating at the Ku - band and higher frequencies, expanding their utility in advanced microwave and millimeter - wave systems.
 

 

Features:
1. Lowest dielectric constant of 2.00 +/- 0.04
2. Low dissipation factor ranging from .0021 to .0027 at 10GHz
3. Low Z-axis coefficient of thermal expansion at 40 ppm/°C
4. Lightweight / low density of 1.4 gm/cm sq.
5. Uniform electrical properties over a wide frequency range
6. Resistant to all solvents and reagents, hot or cold, normally used in etching or plating
 

Some Typical Applications:
1. Airborne antenna system
2. Lightweight feed networks
3. Radar systems
4. Guidance systems
5. Point-to-point digital radio antennas
 

Our PCB Capability (RT duroid 5880LZ)

PCB Capability (RT/duroid 5880LZ)
PCB Material:	Unique Filled PTFE Composites
Designation:	RT/Duroid 5880LZ
Dielectric constant:	2
Dissipation Factor	0.0021 10GHz
Layer count:	Single Sided, Double Sided, Multilayer PCB, Hybrid PCB
Copper weight:	1oz (35µm), 2oz (70µm)
Laminate thickness:	10mil (0.254mm), 20mil (0.508mm), 50mil (1.270mm), 100mil (2.540mm  )
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion silver, Immersion tin, ENEPIG, OSP, Pure gold plated etc..

Typical Value of RT duroid 5880LZ

Property	Typical Value RT/duroid® 5880LZ	Direction	Units	Condition	Test Method
Dielectric Constant er,Process	2.00 ± 0.04	Z		10 GHz/23°C	IPC-TM-650, 2.5.5.5
Dielectric Constant er,Design	2.00	Z		8 GHz - 40 GHz	Differential Phase Length Method
Dissipation Factor, tan	Typ: 0.0021               Max: 0.0027	Z		10GHz/23°C	IPC-TM-650, 2.5.5.5
Thermal Coefficient of Dielectric Constant, er	+20	Z	ppm/°C	-50°C to 150°C 10GHz	IPC-TM-650, 2.5.5.5
Volume Resistivity	1.74 X 10^7		Mohm•cm	C-96/35/90	IPC-TM-650, 2.5.17.1
Surface Resistivity	2.08 X 10^6		Mohm	C-96/35/90	IPC-TM-650, 2.5.17.1
Electrical Strength	40		KV	D48/50	IPC-TM-650, 2.5.6
Dimensional Stability	-0.38	X,Y	%		IPC-TM-650, 2.4.39A
Moisture Absorption	0.31		%	24 hours/23°C	IPC-TM-650, 2.6.2.1
Thermal Conductivity	0.33	Z	W/m/°K	80°C	ASTM C518
Coefficient of Thermal Expansion	54, 47 40	X,Y Z	ppm/°C	0 to 150°C	IPC-TM-650, 2.4.41
Outgassing
TML	0.01		%		ASTM E-595
CVCM	0.01
WVR	0.01
Density	1.4		gm/cm^3		ASTM D792
Copper Peel	>4.0		pli		IPC-TM-650, 2.4.8
Flammability	V-O				UL 94
Lead-Free Process Compatible	YES