Thin 0.5mm thick Multilayer 4 Layer PCB FR4 1oz with Green Solder Mask and ENIG
in Wireless Router
Commodity Introduction
This is a type of FR-4 PCB for the application of Wireless Router. It's a 4 layer board at 0.5mm
thick. The base laminate is from ITEQ, Solder mask and silkscreen from Taiyo. It's fabricated
per IPC 6012 Class 2 using supplied Gerber data. Each 10 boards or panels are packed
separately.
Parameters & Data Sheet
| Item |
Requirement |
Result |
| Laminate |
Type |
FR-4 TG170 |
FR-4 TG170 |
| Supplier |
ITEQ |
ITEQ |
| Board thickness |
0.5+/-10%mm |
0.50-0.6mm |
| Outer copper foil |
>=35 um |
42.58um |
| Inner copper foil |
1/1 OZ |
1/1OZ |
| Warp-twist |
<= 0.75% |
0.33% |
| Legend |
Type |
IJR-4000 MW300 |
IJR-4000 MW300 |
| Color |
White |
White |
| Location |
CS |
CS |
| Marking |
Co.logo |
As requirement |
OK |
| UL.logo |
As requirement |
OK |
| Date code |
As requirement |
OK |
| Marking form |
As requirement |
OK |
| Location |
CS |
CS |
| Min line width (mil) |
5 |
5.2 |
| Min line spacing (mil) |
6 |
5.8 |
| Min ring width (mil) |
NA |
NA |
| Solder Mask |
Type |
PSR-2000GT 600D |
PSR-2000GT 600D |
| Color |
Green |
Green |
| Thickness |
>=10 um |
14 um |
| Pencil Test |
6H OR ABOVE |
OK |
| SOLVENT TEST |
NO ATTACK |
OK |
| TAPE TEST |
NO PEEL OFF |
OK |
| Surface Treamen |
ENIG |
OK |
| Special Treament |
Silk screen |
/ |
/ |
| Location |
/ |
/ |
| Forming |
V-cut |
OK |
| Normal Testing |
Electrical test |
100% PCB passed |
OK |
| Visual inspection |
IPC-A-600H&IPC-6012C |
OK |
| Solderability Test |
245ºC 5S 1 Cycle |
OK |
Finished dimension (unit: mm): including v-cut
| No |
Required Dimension (tolerance) |
Actual Dimension |
| 1 |
163.20 |
163.09 |
163.11 |
163.10 |
163.18 |
| 2 |
201.60 |
201.65 |
201.56 |
201.58 |
201.61 |
Learn PCB and Buy PCB
PCB fabrication Process
1). Contact PCB fabricator
Contact your satisfied vendor such as Bicheng. You're registered and will be quoted for you. Place
your order and follow up the production schedule.
2). Material cutting
Purpose: According to the requirement from engineering data, cut the large plate which is in
compliance with the requirement into small pieces of production board piece to meet customer
requirements of the small sheet.
3). Drill
Purpose: According to the requirement from engineering data, drill all the holes.
4). Copper deposition
Purpose: Copper deposition is a thin copper deposit on the wall of the insulating hole by chemical
method
5). Pattern transfer
Purpose: Pattern transfer is the transfer of image production on the film to the board
6). Pattern plating
Purpose: Pattern electroplating is a layer of copper or gold over nickel or tin that requires a
thickness plated on the exposed copper of the pattern graphic or on the hole wall.
7). Film stripping
Purpose: The NaOH solution is used to strip the anti-plating film to expose the non-pattern circuit
layer.
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