electronic High Frequency Rogers Clte-Xt PCB Board with Ceramic Filled PTFE

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: PTFE
• Model NO.: BIC-209-V3.0
• Material: Fiberglass Epoxy
• Application: Power Amplifiers
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Brand: Rogers
• Solder Mask: Green, Black, Blue, Red, Yellow etc
• Surface Finish: Immersion Gold, HASL, Immersion Silver, Immersion
• Test Method: Ipc TM-650
• Designation: Clte-Xt
• Transport Package: Kk Paper
• Specification: 400mm*500mm
• Trademark: bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
 

General Description

The Rogers CLTE-XT High Frequency PCB is a high-performance circuit board designed for demanding RF and microwave applications. Built on Rogers CLTE-XT laminates, this PCB features a composite of PTFE, woven fiberglass reinforcement, and micro-dispersed ceramic filler. This combination ensures excellent thermal reliability, dimensional stability, and superior electrical performance. With a low dissipation factor of 0.0010 at 10 GHz and a tight dielectric constant tolerance of ±0.03, the CLTE-XT PCB is ideal for high-frequency systems requiring low loss and high reliability.

Features and Benefits
1.Copper-Matched CTE: Matches the coefficient of thermal expansion (CTE) in the X and Y axes for reduced stress.
2.Low Z-Direction CTE: 20 ppm/°C, ensuring reliable plated through holes.
3.Low Dissipation Factor: 0.0010 at 10 GHz, minimizing circuit losses while maintaining dimensional stability.
4.Tight Dielectric Constant Tolerance: ±0.03, with stable Dk across temperature changes.
5.Low Moisture Absorption: 0.02%, enhancing reliability in humid environments.
6.High Thermal Conductivity: 0.56 W/m/K, improving heat dissipation.
7.NASA Outgassing Compliance: Meets NASA outgassing standards for space applications.
 

Our PCB Capability (CLTE-XT Laminates)

PCB Capability (CLTE-XT Laminates)
PCB material:	Ceramic/PTFE Microwave Composite
Designation:	CLTE-XT
Dielectric constant:	2.94
Layer count:	Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB
Dielectric thickness:	5.1mil(0.130mm), 9.4mil (0.239mm), 20mil (0.508mm), 25mil(0.635mm), 30mil(0.762mm), 40mil(1.016mm), 45mil(1.143mm), 59mil(1.499mm), 60mil(1.524mm)
Copper weight:	1oz (35µm), 2oz (70µm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Red, Yellow etc.
Surface finish:	Immersion gold, HASL, Immersion silver, Immersion tin,ENEPIG, Bare copper, OSP, Pure gold plated etc..

The CLTE-XT laminates are compatible with various surface finishes, including HASL, Sn, Ag, Ni/Au, and OSP, without issues. Individual boards can be routed, punched, or laser-cut based on design requirements, tolerances, and edge quality needs.

Typical Applications
1.Advanced Driver Assistance Systems (ADAS)
2.CNI (Communication, Navigation, and Identification) Applications
3.Defense Microwave/RF Applications
4.Microwave Feed Networks
5.Phased Array Antennas
6.Power Amplifiers
7.Patch Antennas
8.Radar Manifolds
9.Satellite & Space Electronics

Data Sheet (CLTE-XT Laminates)

Properties	CLTE-XT	Units	Test Conditions		Test Method
Electrical Properties
Dielectric Constant	2.79 (5.1mil)	-	23˚C @ 50% RH	10 GHz	IPC TM-650 2.5.5.5
	2.89 (9.4mil)
	2.92 (20mil)
	2.94 (30mil)
Dissipation Factor	0.0010	-	23˚C @ 50% RH	10 GHz	IPC TM-650 2.5.5.5
Dielectric Constant (design)	2.93	-	C-24/23/50	10 GHz	Microstrip Differential Phase Length
Thermal Coefficient of Dielectric Constant	-8	ppm/˚C	-50°C to 150°C	10 GHz	IPC TM-650 2.5.5.5
Volume Resistivity	4.25x10^8	Mohm-cm	C-96/35/90	-	IPC TM-650 2.5.17.1
Surface Resistivity	2.49x10^8	Mohm	C-96/35/90	-	IPC TM-650 2.5.17.1
Electrical Strength (dielectric strength)	1000	V/mil	-	-	IPC TM-650 2.5.6.2
Dielectric Breakdown	58	kV	D-48/50	X/Y direc- tion	IPC TM-650 2.5.6
Thermal Properties
Decomposition Temperature (Td)	539	˚C	2hrs @ 105˚C	5% Weight Loss	IPC TM-650 2.3.40
Coefficient of Thermal Expansion - x	12.7	ppm/˚C	-	-55˚C to 288˚C	IPC TM-650 2.4.41
Coefficient of Thermal Expansion - y	13.7	ppm/˚C	-	-55˚C to 288˚C	IPC TM-650 2.4.41
Coefficient of Thermal Expansion - z	40.8	ppm/˚C	-	-55˚C to 288˚C	IPC TM-650 2.4.41
Thermal Conductivity	0.56	W/(m.K)	-	z direction	ASTM D5470
Time to Delamination	>60	minutes	as-received	288˚C	IPC TM-650 2.4.24.1
Mechanical Properties
Copper Peel Strength after Thermal Stress	1.7 (9)	N/mm (lbs/ in)	10s @288˚C	35 μm foil	IPC TM-650 2.4.8
Flexural Strength (MD, CMD)	40.7, 40.0 (5.9, 5.8)	MPa (ksi )	25˚C +_ 3˚C	-	ASTM D790
Tensile Strength (MD, CMD)	29.0, 25.5 (4.2, 3.7)	MPa (ksi )	23C/50RH	-	ASTM D638
Flex Modulus (MD. CMD)	3247, 3261 (471, 473)	MPa (ksi )	25C+_ 3C	-	ASTM D790
Dimensional Stability (MD, CMD)	-0.37, -0.67	mm/m	4 hr at 105˚C	-	IPC-TM-650 2.4.39a
Physical Properties
Flammability	V-0	-	-	C48/23/50 &  C168/70	UL 94
Moisture Absorption	0.02	%	E1/105+D24/23	-	IPC TM-650 2.6.2.1
Density	2.17	g/cm³	C-24/23/50	-	ASTM D792
Specifc Heat Capacity	0.61	J/g˚K	2 hours at 105˚C	-	ASTM E2716
NATA Outgassing
Total Mass Lost	0.02	%	-	-	ASTM E595
Collected Volatiles Condensable Material	0