| Customization: | Available |
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| Type: | Combining Rigid Circuit Board |
| Dielectric: | Rogers Isoclad 917 |
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Brief Introduction
The Rogers IsoClad 917 High Frequency PCB is a high-performance circuit board designed for applications requiring low dielectric constant (Dk) and low dissipation factor (Df). Built on Rogers IsoClad 917 laminates, this PCB features non-woven fiberglass/PTFE composites with a low fiberglass/PTFE ratio, achieving a dielectric constant of 2.17 or 2.20 and a dissipation factor of 0.0013 at 10 GHz. The use of longer random fibers and a proprietary manufacturing process ensures excellent dimensional stability and uniform dielectric properties, making it ideal for conformal antennas, stripline circuits, and radar systems.
Features
1.Low Dielectric Constant (Dk): 2.17 or 2.20 for superior signal integrity.
2.Low Dissipation Factor (Df): 0.0013 at 10 GHz, ensuring minimal signal loss.
3.Extremely Low Loss: Ideal for high-frequency and RF applications.
4.Low Moisture Absorption: Enhances reliability in humid environments.
5.Highly Isotropic: Uniform properties in X, Y, and Z directions for consistent performance.
Typical Applications
1.Conformal Antennas
2.Stripline and Microstrip Circuits
3.Guidance Systems
4.Radar Systems
Our PCB Capability (IsoClad 917)
| PCB Capability (IsoClad 917) | |
| PCB Material: | Non-woven Fiberglass / PTFE Composites |
| Designation: | IsoClad 917 |
| Dielectric constant: | 2.17 or 2.20 (10 GHz) |
| Dissipation factor | 0.0013 (10 GHz) |
| Layer count: | Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Dielectric thickness | 20mil (0.508mm), 31mil (0.787mm), 62mil (1.575mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | ENIG(immersion gold), HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold plated etc.. |
Our Advantages
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is a leading high-frequency PCB supplier and exporter based in Shenzhen, China. With over 19 years of experience, we specialize in serving industries such as cellular base station antennas, satellite systems, high-frequency passive components, microstrip and band line circuits, millimeter-wave equipment, radar systems, and digital radio frequency antennas. Our high-frequency PCBs are primarily built on materials from Rogers Corporation, Taconic, and Wangling, with dielectric constants ranging from 2.2 to 10.2.
We also offer a wide range of PCB solutions, including FR-4 circuit boards, flexible circuits, and metal core PCBs, catering to prototypes, small runs, and mass production. Our expertise extends to high-value-added projects such as HDI, quick-turn PCBs, impedance control, heavy copper boards, and backplane boards. This comprehensive product line allows us to meet diverse customer needs, from low-end to high-end applications.
Appendix: Typical Values of IsoClad 917
| IsoClad 917 | Typical Properties: | ||
| Property | IsoClad 917 | Condition | Test Method |
| Dielectric Constant @ 10 GHz | 2.17, 2.20 | C23/50 | IPC TM-650 2.5.5.5 |
| Dissipation Factor @ 10 GHz | 0.0013 | C23/50 | IPC TM-650 2.5.5.5 |
| Thermal Coefficient of Er (ppm/°C) | -157 | -10°C to +140°C | IPC TM-650 2.5.5.5 Adapted |
| Peel Strength (lbs.per inch) | 10 | After Thermal | IPC TM-650 2.4.8 |
| Volume Resistivity (MΩ-cm) | 1.5 x 1010 | C96/35/90 | IPC TM-650 2.5.17.1 |
| Surface Resistivity (MΩ) | 1.0 x 10 9 | C96/35/90 | IPC TM-650 2.5.17.1 |
| Arc Resistance (seconds) | >180 | D48/50 | ASTM D-495 |
| Tensile Modulus (kpsi) | 133, 120 | A, 23°C | ASTM D-638 |
| Tensile Strength (kpsi) | 4.3, 3.8 | A, 23°C | ASTM D-882 |
| Compressive Modulus (kpsi) | 182 | A, 23°C | ASTM D-695 |
| Flexural Modulus (kpsi) | 213 | A, 23°C | ASTM D-790 |
| Dielectric Breakdown (kv) | >45 | D48/50 | ASTM D-149 |
| Density (g/cm3) | 2.23 | A, 23°C | ASTM D-792 Method A |
| Water Absorption (%) | 0.04 | E1/105 + D24/23 | MIL-S-13949H 3.7.7 IPC TM-650 2.6.2.2 |
| Coefficient of Thermal | 0°C to 100°C | Coefficient of Thermal | |
| Expansion (ppm/°C) | Mettler 3000 | ||
| X Axis | 46 | Thermomechanical | |
| Y Axis | 47 | Analyzer | |
| Z Axis | 236 | ||
| Thermal Conductivity (W/mK) | 0.263 | 100°C | ASTM E-1225 |
| Outgassing | 125°C, ≤10-6 torr | ||
| Total Mass Loss (%) | 0.02 | Maximum 1.00% | |
| Collected Volatile | 0.00 | Maximum 0.10% | |
| Condensable Material (%) | |||
| Water Vapor Regain (%) | 0.02 | ||
| Visible Condensate (±) | NO | ||
| Flammability | Meets requirements of UL94-V0 |
C48/23/50, E24/125 | UL 94 Vertical Burn IPC TM-650 2.3.10 |
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