Ad300d 2-Layer PCB for Antenna Circuit Boards

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Ad300d
• Model NO.: BIC-1192-V3.0
• Material: Ad300d Laminate
• Application: Telecommunications
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Enig
• Base Material: Ad300d Laminate
• Insulation Materials: Ad300d Substrate
• Brand: Unspecified
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Shipping Vacuum Packaging
• Specification: 32.91mm × 40.41mm (± 0.15mm)
• Trademark: bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
 

Overview of This Type of PCB

The AD300D 2-layer printed circuit board is a high-performance RF solution designed for antenna applications, combining ceramic-filled PTFE with glass reinforcement for optimal electrical and mechanical performance. With a tightly controlled dielectric constant (Dk=2.94±0.05) and ultra-low loss tangent (0.0021 at 10GHz), this PCB delivers exceptional signal integrity for telecom infrastructure. Its -159dBc PIM performance and >500°C decomposition temperature ensure reliability in demanding environments, while the 40mil thick core provides structural stability for automotive and satellite antenna systems.

 

 

PCB Construction Details (Summary Table)

Item	Specification
Material	AD300D
Layers	2
Board Size	61.32×21.92mm (±0.15mm)
Min. Trace/Space	4/4 mils
Min. Hole Size	0.3mm
Blind Vias	No
Thickness	1.1mm (40mil)
Copper Weight	1oz (35μm)
Via Plating	20μm
Surface Finish	Immersion Gold
Silkscreen	Black (Top)
Solder Mask	None
Electrical Test	100% Tested

 

Other Key Components & Features
Stackup:

• Copper layer 1 - 35 μm
  AD300D - 1.016 mm (40mil)
  Copper layer 2 - 35 μm

• 
  PCB Statistics:
  Components:        12
  Total Pads:         28
  Thru Hole Pads:     19
  Top SMT Pads:      9
  Bottom SMT Pads:    0
  Vias:            27
  Nets:              2
   

Material Advantages:

• 1.PIM Performance: -159dBc at 30mils spacing

• 2.Thermal Stability: >60 minutes to delamination

• 3.Process Control: ±0.05 Dk tolerance

• 4.Safety Certified: UL 94-V0 flammability rating

• •  

• 

• Typical Applications:

• Cellular infrastructure base station antenna
  Automotive telematics antenna systems
  Commercial satellite radio antenna

•  

Why Choose This PCB?

• 1.Signal Quality: Industry-leading PIM characteristics

• 2.Power Handling: Enhanced thermal performance

• 3.Manufacturing Efficiency: Standard PTFE processing

•  

Tags:AD300D PCB, 2-Layer Circuit Board, Antenna Electronics, Low-PIM

 

Order Now for:

High-reliability antenna systems requiring certified low PIM and stable RF performance.
 

Additional Notes:

Type of artwork supplied: Gerber RS-274-X
Quality standard: IPC-Class-2
Availability: Worldwide