High-Frequency Diclad 870 RF Circuit Board: Precision 2-Layer Design with Dual-Side Green Solder Mask

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Diclad 870
• Model NO.: BIC-1128-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers/Taconic/Wangling
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

High-Frequency DiClad 870 RF Circuit Board: Precision 2-Layer Design with Dual-Side Green Solder Mask
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


1. Advanced RF Circuit Board Overview
Engineered for superior high-frequency performance, our DiClad 870 printed circuit boards combine Rogers' innovative material technology with precision manufacturing. These premium 2-layer PCBs utilize DiClad 870's specialized PTFE composite with optimized fiberglass reinforcement, delivering exceptional signal integrity for demanding RF applications.

Featuring an ultra-low dielectric constant of 2.33 at 10GHz and remarkably consistent dissipation factor (0.0013 at 10GHz), these circuit boards are specifically designed for high-performance wireless systems. The 0.8mm profile with industry-leading 4/4 mil trace spacing enables compact, high-density designs for aerospace and telecommunications applications.

With comprehensive green solder mask coverage on both surfaces and crisp white silkscreen markings, these boards offer both superior electrical performance and practical manufacturability. Each unit undergoes exhaustive IPC-Class-2 compliant testing and complete electrical verification to guarantee reliability in mission-critical environments.


2. Detailed Technical Specifications

Characteristic	Precision Specification
Core Material	Rogers DiClad 870 Composite
Board Configuration	Dual-layer rigid construction
Unit Dimensions	174 × 44.5mm (±0.15mm)
Overall Thickness	0.8mm (31mil core)
Circuit Geometry	4/4 mil trace/space
Minimum Aperture	0.25mm drilled holes
Conductive Layers	35μm copper (1oz) both surfaces
Via Structure	20μm plated through-holes
Surface Treatment	ENEPIG finish
Legend Printing	White on both sides
Protective Coating	Green solder mask (dual-side)
Quality Assurance	100% electrical validation

3. Cutting-Edge Features & Applications


Material Advantages:
Unparalleled Signal Fidelity: Exceptionally low 0.0013 loss tangent at 10GHz minimizes RF attenuation

Thermal Consistency: -161 ppm/°C Dk temperature coefficient maintains stability

Environmental Resilience: Industry-leading 0.02% moisture absorption rating

Mechanical Integrity: CTE values of 17/29/217 ppm/°C (X/Y/Z) prevent deformation


Design Capabilities:
High Component Integration: Accommodates 42 devices with 103 connection points (68 through-hole, 35 SMT)

Advanced Interconnect Solutions: 73 precision vias support complex 3-net routing

Manufacturing Compatibility: Accepts standard Gerber RS-274-X design files


Primary Applications:
Radar Technology: Advanced feed networks and antenna systems

5G Infrastructure: High-efficiency base station components

Aerospace Electronics: Navigation and guidance systems

Defense Systems: Phased array radar elements

Telecommunications: Low-noise amplifiers and signal filters


Why DiClad 870 PCBs Excel
These high-frequency circuit boards deliver exceptional RF characteristics combined with outstanding production consistency. The optimized PTFE-fiberglass formulation provides superior dimensional control while maintaining excellent electrical properties across wide frequency ranges. With global manufacturing support and rigorous quality protocols, DiClad 870 PCBs represent the ideal solution for engineers developing next-generation wireless technologies.


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Thank you for your reading and you're welcome to contact us for your PCB enquiries.