Customization: | Available |
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Type: | Rigid Circuit Board |
Dielectric: | F4btms350 |
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Parameter | Detail |
Base Material | F4BTMS350 |
Layer Count | 2 |
Board Dimensions | 76mm x 76mm, +/- 0.15mm |
Minimum Trace/Space | 6/7 mils |
Minimum Hole Size | 1.5mm |
Blind Vias | No |
Finished Board Thickness | 6.42mm |
Finished Cu Weight (Outer Layers) | 1oz (1.4 mils) |
Via Plating Thickness | 20 μm |
Surface Finish | Hot Air Soldering Level (HASL) |
Top Silkscreen | No |
Bottom Silkscreen | No |
Top Solder Mask | No |
Bottom Solder Mask | No |
Pre-shipment Test | 100% Electrical Test |