12mil Rogers RO4360g2 Wholesale Electronics PCB Manufacturing for Power Amplifiers

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: BIC-114-V2.1
• Material: Hydrocarbon Ceramic-Filled Thermoset Materials
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Model: PCB
• Brand: Rogers
• Application: Base Station
• Thickness: 12mil
• Layer Count: 2-Layer
• Surface Finish: Immersion Gold
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

12mil Double Sided Rogers RO4360G2 RF PCB for Base Station Power Amplifiers
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

RO4360G2 laminates of Rogers Corporation are 6.15 Dk, low loss, glass-reinforced, hydrocarbon ceramic-filled thermoset materials that provide the ideal balance of performance and processing ease. RO4360G2 laminates extend Rogers' portfolio of high performance materials by providing customers with a product that is lead-free process capable and offers better rigidity for improved processability in multi-layer board constructions, while reducing material and fabrication costs.

RO4360G2 laminates process similar to FR-4 and are automated assembly compatible. They have a low Z-axis CTE for design flexibility and have the same high Tg as all of the RO4000 product line. RO4360G2 laminates can be paired with RO4450F prepreg and lower-Dk RO4000 laminate in multi-layer designs.

RO4360G2 laminates, with a Dk of 6.15 (Design Dk 6.4), allow designers to reduce circuit dimensions in applications where size and cost are critical. They are the best value choice for engineers working on designs including power amplifiers, patch antennas, ground-based radar, and other general RF applications.


Features and benefits:
1. Thermoset resin system specially formulated to meet 6.15 Dk
1). Ease of fabrication / processes similar to FR-4
2). Material repeatability
3). Low loss
4). High thermal conductivity
5). Lower total PCB cost solution than competing PTFE products,

2. Low Z-axis CTE / High Tg
1). Design flexibility
2). Plated through-hole reliability
3). Automated assembly compatible

3. Environmentally friendly
1.) Lead free process compatible

4. Regional finished goods inventory
1). Short lead times / quick inventory turns
2). Efficient supply chain

Some Typical Applications:
1. Base Station Power Amplifiers
2. Small Cell Transceivers
3. Patch antennas
4. Ground-based Radar
 

PCB Capability

PCB Capability (RO4360G2)
PCB Material:	Hydrocarbon Ceramic-filled Thermoset Materials
Designation:	RO4360G2
Dielectric constant:	6.15 ±0.15
Layer count:	Double Layer, Multilayer, Hybrid PCB
Copper weight:	1oz (35µm), 2oz (70µm)
PCB thickness:	8mil (0.203mm), 12mil (0.705mm), 16mil (0.406mm), 20mil(0.508mm), 24mil (0.610mm), 32mil (0.813mm), 60mil(1.524mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold  etc..

Data Sheet of RO4360G2

RO4360G2 Typical Value
Property	RO4360G2	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	6.15±0.15	Z		10 GHz/23ºC	IPC-TM-650 2.5.5.5
				2.5 GHz/23ºC
Dissipation Factor,tanδ	0.0038	Z		10 GHz/23ºC	IPC-TM-650 2.5.5.5
Thermal Conductivity	0.75		W/mK	50ºC	ASTM D-5470
Volume Resistivity	4.0 X 1013		Ω.cm	Elevated T	IPC-TM-650  2.5.17.1
Surface Resistivity	9.0 X 1012		Ω	Elevated T	IPC-TM-650  2.5.17.1
Electrical Strength	784	Z	V/mil		IPC-TM-650  2.5.6.2
Tensile Strength	131 (19)     97(14)	X                 Y	MPa (kpsi)	40 hrs 50%RH/23	ASTM D638
Flexural Strength	213(31)     145(21)	X                 Y	Mpa (kpsi)	40 hrs 50%RH/23	IPC-TM-650, 2.4.4
Coefficient of Thermal Expansion	13                     14                              28	X                      Y                         Z	ppm/ºC	-50 ºCto 288ºC  After Replicated Heat Cycle	IPC-TM-650, 2.1.41
Tg	>280		ºC TMA		IPC-TM-650 2.4.24.3
Td	407		ºC		ASTM D3850 using TGA
T288	>30	Z	min	30 min / 125ºC Prebake	IPC-TM-650 2.2.24.1
Moisure Absorption	0.08		%	50ºC/48hr	IPC-TM-650 2.6.2.1 ASTM D570
Thermal Coefficient of er	-131 @10 GHz	Z	ppm/ºC	-50ºC to 150 ºC	IPC-TM-650, 2.5.5.5
Density	2.16		gm/cm3	RT	ASTM D792
Copper Peel Stength	5.2 (0.91)		pli (N/mm)	Condtion B	IPC-TM-650 2.4.8
Flammability	V-0				UL 94 File QMTS2. E102765